Analysis of no-clean flux spatter during the soldering process
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00332430" target="_blank" >RIV/68407700:21230/20:00332430 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1016/j.jmatprotec.2019.116289" target="_blank" >https://doi.org/10.1016/j.jmatprotec.2019.116289</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.jmatprotec.2019.116289" target="_blank" >10.1016/j.jmatprotec.2019.116289</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Analysis of no-clean flux spatter during the soldering process
Popis výsledku v původním jazyce
The investigation of the flux spattering in dependency on surface roughness of the substrate was conducted in order to decrease reliability issues during reflow soldering caused by insulating character of flux residues. Sample boards with matt and glossy solder mask, HASL and ENIG surface finish and two types of SAC305 lead-free solder paste with different flux chemistry (ROL1 and ROL0) were used in the experiment. The number of the flux residues, their area and the area of flux spreading around a soldering pad were evaluated by the image analysis. The dependency of the flux spattering on flux spread was found. The use of glossy solder mask instead of matt solder mask reduced the number of flux residues by approximately 50%.
Název v anglickém jazyce
Analysis of no-clean flux spatter during the soldering process
Popis výsledku anglicky
The investigation of the flux spattering in dependency on surface roughness of the substrate was conducted in order to decrease reliability issues during reflow soldering caused by insulating character of flux residues. Sample boards with matt and glossy solder mask, HASL and ENIG surface finish and two types of SAC305 lead-free solder paste with different flux chemistry (ROL1 and ROL0) were used in the experiment. The number of the flux residues, their area and the area of flux spreading around a soldering pad were evaluated by the image analysis. The dependency of the flux spattering on flux spread was found. The use of glossy solder mask instead of matt solder mask reduced the number of flux residues by approximately 50%.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2020
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Journal of Materials Processing Technology
ISSN
0924-0136
e-ISSN
1873-4774
Svazek periodika
275
Číslo periodika v rámci svazku
January
Stát vydavatele periodika
CH - Švýcarská konfederace
Počet stran výsledku
5
Strana od-do
—
Kód UT WoS článku
000517123200007
EID výsledku v databázi Scopus
2-s2.0-85070209486