Temperature distribution in solder joints during melting and solidification

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00233978" target="_blank" >RIV/68407700:21230/15:00233978 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ATEE.2015.7133853" target="_blank" >http://dx.doi.org/10.1109/ATEE.2015.7133853</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ATEE.2015.7133853" target="_blank" >10.1109/ATEE.2015.7133853</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Temperature distribution in solder joints during melting and solidification

Popis výsledku v původním jazyce

The most vulnerable components of electronic circuits (PCA - Printed Circuit Assembly) are the solder joints. During the soldering process different anomalies may occur (changes in the reflow temperature profile, different cooling rates) leading to the inception of some defects, as excessive voids inside the solder, brittle phase formation, concentration gradients of elements or metallurgical composition etc. To avoid this, it is mandatory to follow the parameter values of the reflow process (speed, temperature values etc.). Temperature computing model for two PCA samples during the reflow soldering process, by using Comsol Multiphysics software (heat transfer 3 D module) is presented in this paper. PCA samples with and without resistor contains substrate with two soldering pads together with lead free solder. To carry out the computations, the latent heat of fusion/solidification and the variation with the temperature of the alloy parameters were considered. The results show that the presence of the resistor leads to the decrease of the temperature in the alloy during melting and its increase during solidification.

Název v anglickém jazyce

Temperature distribution in solder joints during melting and solidification

Popis výsledku anglicky

The most vulnerable components of electronic circuits (PCA - Printed Circuit Assembly) are the solder joints. During the soldering process different anomalies may occur (changes in the reflow temperature profile, different cooling rates) leading to the inception of some defects, as excessive voids inside the solder, brittle phase formation, concentration gradients of elements or metallurgical composition etc. To avoid this, it is mandatory to follow the parameter values of the reflow process (speed, temperature values etc.). Temperature computing model for two PCA samples during the reflow soldering process, by using Comsol Multiphysics software (heat transfer 3 D module) is presented in this paper. PCA samples with and without resistor contains substrate with two soldering pads together with lead free solder. To carry out the computations, the latent heat of fusion/solidification and the variation with the temperature of the alloy parameters were considered. The results show that the presence of the resistor leads to the decrease of the temperature in the alloy during melting and its increase during solidification.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE 2015)

ISBN

978-1-4799-7514-3

ISSN

—

e-ISSN

—

Počet stran výsledku

7

Strana od-do

500-506

Název nakladatele

Institute of Electrical and Electronics Engineers

Místo vydání

New York

Místo konání akce

Bucharest

Datum konání akce

7. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000368159800095