Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00332575" target="_blank" >RIV/68407700:21230/19:00332575 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8810306" target="_blank" >https://ieeexplore.ieee.org/document/8810306</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2019.8810306" target="_blank" >10.1109/ISSE.2019.8810306</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor

Popis výsledku v původním jazyce

The intermetallic compounds growth at the interface between the eutectic solder Bi58Sn42 and the copper soldering pad was examined in dependence on the temperature profile selection that was expressed by a heating factor (combined influence of time and temperature above the melting point of the solder alloy). Eight temperature profiles were used for reflow soldering. In contrast to other studies, almost the identical value of the heating factor was achieved by the different shapes of the profiles in order to evaluate the effect of the whole profile shape. Consequently, the metallographic cross-sections of the solder joints were analyzed by scanning electron microscopy. Additionally, the shear strength test of solder joints and the transition resistance measurement were conducted. As expected, the intermetallic layer thickness increased with an increasing heating factor, but a different thickness was observed for the identical heating factor when the whole shape of temperature profile including the preheating phase was changed. On the other hand, the prediction of IMC growth based on heating factor can be used in situations, where only the melting phase varies and the preheating remains constant - but the influence of the heating factor on intermetallic layer thickness cannot be generally formulated for a specific solder alloy due to a strong dependence on the flux.

Název v anglickém jazyce

Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor

Popis výsledku anglicky

The intermetallic compounds growth at the interface between the eutectic solder Bi58Sn42 and the copper soldering pad was examined in dependence on the temperature profile selection that was expressed by a heating factor (combined influence of time and temperature above the melting point of the solder alloy). Eight temperature profiles were used for reflow soldering. In contrast to other studies, almost the identical value of the heating factor was achieved by the different shapes of the profiles in order to evaluate the effect of the whole profile shape. Consequently, the metallographic cross-sections of the solder joints were analyzed by scanning electron microscopy. Additionally, the shear strength test of solder joints and the transition resistance measurement were conducted. As expected, the intermetallic layer thickness increased with an increasing heating factor, but a different thickness was observed for the identical heating factor when the whole shape of temperature profile including the preheating phase was changed. On the other hand, the prediction of IMC growth based on heating factor can be used in situations, where only the melting phase varies and the preheating remains constant - but the influence of the heating factor on intermetallic layer thickness cannot be generally formulated for a specific solder alloy due to a strong dependence on the flux.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-1874-1

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Wroclaw

Datum konání akce

15. 5. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000507501000078