Surface Roughness Influence on Solderability

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F09%3A00501574" target="_blank" >RIV/49777513:23220/09:00501574 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Surface Roughness Influence on Solderability

Popis výsledku v původním jazyce

The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. This comparison will be made for several surface finish types. Test specimens of printed circuit boards with surface finishes SnG (galvanic tin), SnC (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) were tested. The test specimens werepurposely roughened by different abrasive paper before solderability testing. Roughness created on surface finishes were oriented vertically and horizontally.

Název v anglickém jazyce

Surface Roughness Influence on Solderability

Popis výsledku anglicky

The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. This comparison will be made for several surface finish types. Test specimens of printed circuit boards with surface finishes SnG (galvanic tin), SnC (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) were tested. The test specimens werepurposely roughened by different abrasive paper before solderability testing. Roughness created on surface finishes were oriented vertically and horizontally.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

International Spring Seminar on Electronics Technology

ISBN

978-1-4244-4260-7

ISSN

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e-ISSN

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Počet stran výsledku

6

Strana od-do

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Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Brno

Datum konání akce

17. 5. 2009

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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