Double-sided Preheating Influence on Solderability

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F08%3A00500315" target="_blank" >RIV/49777513:23220/08:00500315 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Double-sided Preheating Influence on Solderability

Popis výsledku v původním jazyce

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electrolessnickel immersion gold), OSP (organic solderability preservative) and pure copper.

Název v anglickém jazyce

Double-sided Preheating Influence on Solderability

Popis výsledku anglicky

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). For measurement was used one of the solderability evaluation methods known as the wetting balance test. The wetting balance test measures the wetting forces imposed by the molten solder on the test surface as it is dipped into and held in the solder bath as a function of time. Paper will present the comparison of results of printed circuit board solderability test with preheating in agreement with IPC/EIA J-STD-003A, with IEC 60068-2-54 and with hot air double-sided preheating. This comparison will be also made for several lead-free surface finish types. It was tested printed circuit board coupons with surface finishing of galvanic tin, immersion tin, ENIG (electrolessnickel immersion gold), OSP (organic solderability preservative) and pure copper.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2008

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2008

ISBN

978-1-4244-3973-7

ISSN

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e-ISSN

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Počet stran výsledku

6

Strana od-do

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Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Budapešť

Datum konání akce

1. 1. 2008

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000272337900079