Pájitelnost DPS s bezolovnatou povrchovou úpravou

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Solderability of lead-free surface finished PCB

Popis výsledku v původním jazyce

This paper deals with results of solderability testing. The wetting balance test is used for the evaluation of wetting performance. Dissolving and removing of oxides and contaminations from the surface of a metal or alloy are the primary purposes of flux. Activated metal surface is easily wetted by the molten solder. However flux is corrosive. Other way of cleaning is the special cleaning liquid, e.g. Decotron F10. The paper presents the comparison of printed circuit board solderability test results measured before and after cleaning. This comparison will be made for several surface finish types. Coupons of printed circuit boards with surface finishes galvanic tin, immersion tin, pure copper, OSP (organic solderability preservative) and ENIG (electro less nickel immersion gold) were tested. The environment of storage can affect the solderability of surface. That is why the solderability was measured before and after ageing also.

Název v anglickém jazyce

Solderability of lead-free surface finished PCB

Popis výsledku anglicky

This paper deals with results of solderability testing. The wetting balance test is used for the evaluation of wetting performance. Dissolving and removing of oxides and contaminations from the surface of a metal or alloy are the primary purposes of flux. Activated metal surface is easily wetted by the molten solder. However flux is corrosive. Other way of cleaning is the special cleaning liquid, e.g. Decotron F10. The paper presents the comparison of printed circuit board solderability test results measured before and after cleaning. This comparison will be made for several surface finish types. Coupons of printed circuit boards with surface finishes galvanic tin, immersion tin, pure copper, OSP (organic solderability preservative) and ENIG (electro less nickel immersion gold) were tested. The environment of storage can affect the solderability of surface. That is why the solderability was measured before and after ageing also.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2007

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2007

ISBN

1-4244-1218-8

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

388-392

Název nakladatele

Technical University

Místo vydání

Cluj-Napoca

Místo konání akce

Cluj-Napoca

Datum konání akce

1. 1. 2007

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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