Influence of special cleaning compounds on PCBs solderability

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of special cleaning compounds on PCBs solderability

Popis výsledku v původním jazyce

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). Several types of cleaning substances were used for PCB cleaning. Isopropylalcohol and special cleaning liquids were applied on PCBs before solderability testing. Most often used lead-free surface finishes were tested. (galvanic tin, immersion tin,electro less nickel immersion gold, organic solderability preservative and pure copper). Two methods of solderability evaluation were used for solderability assessment(wetting balance test (WBT) and area of spread (AOS) method). Paper will present solderability results after different cleaning substances application. We can see solderability improvement, represented by lower contact angles and higher wetting forces. Except these results, paper will also present the comparison of two different methods of solderability testing.

Název v anglickém jazyce

Influence of special cleaning compounds on PCBs solderability

Popis výsledku anglicky

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). Several types of cleaning substances were used for PCB cleaning. Isopropylalcohol and special cleaning liquids were applied on PCBs before solderability testing. Most often used lead-free surface finishes were tested. (galvanic tin, immersion tin,electro less nickel immersion gold, organic solderability preservative and pure copper). Two methods of solderability evaluation were used for solderability assessment(wetting balance test (WBT) and area of spread (AOS) method). Paper will present solderability results after different cleaning substances application. We can see solderability improvement, represented by lower contact angles and higher wetting forces. Except these results, paper will also present the comparison of two different methods of solderability testing.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2008

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ESTC 2008

ISBN

978-1-4244-2813-7

ISSN

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e-ISSN

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Počet stran výsledku

4

Strana od-do

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Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Greenwich

Datum konání akce

1. 1. 2008

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000261094400025