Glutaric acid as a flux substitute for soldering on ceramic substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968767" target="_blank" >RIV/49777513:23220/23:43968767 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10168381" target="_blank" >https://ieeexplore.ieee.org/document/10168381</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168381" target="_blank" >10.1109/ISSE57496.2023.10168381</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Glutaric acid as a flux substitute for soldering on ceramic substrates

Popis výsledku v původním jazyce

This article deals with using glutaric acid as a flux substitute for soldering on ceramic substrates with conductive patterns created by thick printed copper technology (TPC). The main goal of the research was to create high quality connections by soldering on ceramic substrates, together with elimination of conventional flux from the process. Conventional flux brings additional expenses because of its difficult cleaning after the soldering process. Necessity of connecting large surface chips is becoming increasingly relevant due the rising demand for power electronics, but brings out several challenges, especially on ceramic substrates. Further in the article is discussed soldering process optimization, its enhancement by using formic acid vapours for additional wetting. X-ray analysis for voids and shear test for determining mechanical resistance were also performed. Results shows that using the glutaric acid as a flux substitute yield joints of similar quality on comparison to conventional flux, with high shear strength and low amount and size of the voids.

Název v anglickém jazyce

Glutaric acid as a flux substitute for soldering on ceramic substrates

Popis výsledku anglicky

This article deals with using glutaric acid as a flux substitute for soldering on ceramic substrates with conductive patterns created by thick printed copper technology (TPC). The main goal of the research was to create high quality connections by soldering on ceramic substrates, together with elimination of conventional flux from the process. Conventional flux brings additional expenses because of its difficult cleaning after the soldering process. Necessity of connecting large surface chips is becoming increasingly relevant due the rising demand for power electronics, but brings out several challenges, especially on ceramic substrates. Further in the article is discussed soldering process optimization, its enhancement by using formic acid vapours for additional wetting. X-ray analysis for voids and shear test for determining mechanical resistance were also performed. Results shows that using the glutaric acid as a flux substitute yield joints of similar quality on comparison to conventional flux, with high shear strength and low amount and size of the voids.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

979-8-3503-3484-5

ISSN

—

e-ISSN

2161-2528

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Timisoara, Romania

Datum konání akce

10. 5. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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