The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972537" target="_blank" >RIV/49777513:23220/24:43972537 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10603787" target="_blank" >https://ieeexplore.ieee.org/document/10603787</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10603787" target="_blank" >10.1109/ISSE61612.2024.10603787</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer

Popis výsledku v původním jazyce

This paper deals with the effect of the formic acid vapours on the thickness and roughness of the conductive layer during oxide reduction process. To fully understand influence of the process is important for the main goal of the whole research, which is creation of high-quality connections by soldering while abandoning from conventional flux in the process. By not using the flux, cleaning and impurities issues can be fully avoided, thus increasing the quality and reducing the price of final products. Conductive layers thickness was analysed by laser confocal microscopy before and after controlled oxidation and afterward oxide reduction process. In the article are discussed several different scenarios that can occur when dealing with differently oxidized substrates, how to handle them, and the effect of differently setup cleaning profiles. Overall suitability of the usage of the formic acid vapours for cleaning of the oxidation of the copper conductive paths is stated.

Název v anglickém jazyce

The Effect of Oxide Reduction Using Formic Acid Vapours on The Thickness of The Conductive Layer

Popis výsledku anglicky

This paper deals with the effect of the formic acid vapours on the thickness and roughness of the conductive layer during oxide reduction process. To fully understand influence of the process is important for the main goal of the whole research, which is creation of high-quality connections by soldering while abandoning from conventional flux in the process. By not using the flux, cleaning and impurities issues can be fully avoided, thus increasing the quality and reducing the price of final products. Conductive layers thickness was analysed by laser confocal microscopy before and after controlled oxidation and afterward oxide reduction process. In the article are discussed several different scenarios that can occur when dealing with differently oxidized substrates, how to handle them, and the effect of differently setup cleaning profiles. Overall suitability of the usage of the formic acid vapours for cleaning of the oxidation of the copper conductive paths is stated.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

979-8-3503-8547-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Prague, Czech Republic

Datum konání akce

15. 5. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001283808200037