Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU98701" target="_blank" >RIV/00216305:26220/12:PU98701 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Popis výsledku v původním jazyce

An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste wasused as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical

Název v anglickém jazyce

Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Popis výsledku anglicky

An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste wasused as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings

ISBN

978-1-4673-2241-6

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

201-206

Název nakladatele

Vienna University of Technology

Místo vydání

Gusshausstrasse 27- 29, A-1040 WIEN - Austria: I

Místo konání akce

Bad Aussee

Datum konání akce

9. 5. 2012

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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