MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY

Popis výsledku v původním jazyce

Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such astype of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert ? nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity.For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples

Název v anglickém jazyce

MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY

Popis výsledku anglicky

Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such astype of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert ? nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity.For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings - Electronic Devices and Systems - EDS '13

ISBN

9788021447547

ISSN

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e-ISSN

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Počet stran výsledku

4

Strana od-do

146-149

Název nakladatele

Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

26. 6. 2013

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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