Effect of reflow technology and surface finishes of PCB on solder spreading

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F13%3A10190702" target="_blank" >RIV/00216208:11320/13:10190702 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/13:00210827

Výsledek na webu

<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06648230" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06648230</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2013.6648230" target="_blank" >10.1109/ISSE.2013.6648230</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of reflow technology and surface finishes of PCB on solder spreading

Popis výsledku v původním jazyce

A key process in surface mount technology is soldering, when a metallurgical joint is formed between the molten solder and metal surfaces. Solders in molten state have to show good spreading action together with good wetting of substrate. Molten solder flows or spreads on the metal surface to ensure good future formation of solder joint. Monitoring of solder spreading is one of the tools which can be used to solderability and wettability quantification. Measurement of spreading of molten solders is oneof the tools that can be used to estimation of their wettability and solderability. Each solder has a different degree of spreading on the metal surface. Degree of spreading mainly depends on combination of flux, solder alloy, soldered substrate. This study is focused to investigate effect of reflow technology and PCBs surface finishes on spreading of molten solders. In our experiment we used four types of surface finishes (lead free HASL., passivated cooper, ENIG and immersion Sn), five

Název v anglickém jazyce

Effect of reflow technology and surface finishes of PCB on solder spreading

Popis výsledku anglicky

A key process in surface mount technology is soldering, when a metallurgical joint is formed between the molten solder and metal surfaces. Solders in molten state have to show good spreading action together with good wetting of substrate. Molten solder flows or spreads on the metal surface to ensure good future formation of solder joint. Monitoring of solder spreading is one of the tools which can be used to solderability and wettability quantification. Measurement of spreading of molten solders is oneof the tools that can be used to estimation of their wettability and solderability. Each solder has a different degree of spreading on the metal surface. Degree of spreading mainly depends on combination of flux, solder alloy, soldered substrate. This study is focused to investigate effect of reflow technology and PCBs surface finishes on spreading of molten solders. In our experiment we used four types of surface finishes (lead free HASL., passivated cooper, ENIG and immersion Sn), five

Druh

D - Stať ve sborníku

CEP obor

BM - Fyzika pevných látek a magnetismus

OECD FORD obor

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Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-4799-0036-7

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

4

Strana od-do

136-139

Název nakladatele

IEEE

Místo vydání

Rumunsko

Místo konání akce

Alba Iulia; Romania

Datum konání akce

8. 5. 2013

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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