Effect of non-standard SnAg surface finishes on properties of solder joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00370276" target="_blank" >RIV/68407700:21230/23:00370276 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.apsadv.2023.100483" target="_blank" >https://doi.org/10.1016/j.apsadv.2023.100483</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.apsadv.2023.100483" target="_blank" >10.1016/j.apsadv.2023.100483</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of non-standard SnAg surface finishes on properties of solder joints

Popis výsledku v původním jazyce

In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near eutectic SnAg alloys with different compositions and numbers of layers were analyzed. Design/methodology/approach: The effect of surface-finishes SnAg5NiP and SnAg7NiP, which were prepared with and without a Ni-P diffusion barrier, was tested. The Ni-P layer was produced either chemically or electrochemically. The effect of the SnAg surface finish on wettability, formation, and growth of intermetallic compound in the solder joint was analyzed. We further explored the impact of different PCB finishes on the quality of soldered joints. This investigation involved a comparative analysis of the behavior of SnAg finishes in comparison to pure copper, as well as the commonly employed HASL, ENIG, and ImSn finishes.Findings: It was found that SnAg surface finishes with a Ni-P diffusion barrier are wetted by molten solder faster than surface finishes without a diffusion barrier. The mechanical properties of the joints on both surfaces are comparable to those on ENIG. SnAg that include a chemically created Ni-P diffusion layer is characterized by the formation of more thermally stable ternary intermetallic compounds based on (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. On the contrary, the electrochemically formed Ni layer supports the increase in the rate of intermetallic compound formation, which affects the properties of the soldered joints.Originality: Nonstandard near-eutectic SnAg finishes, which contains a Ni-P diffusion layer can be used as promising replacement of ENIG or other standard finishes.

Název v anglickém jazyce

Effect of non-standard SnAg surface finishes on properties of solder joints

Popis výsledku anglicky

In this study, the effects of nonstandard near-eutectic SnAg surfaces on the wettability, intermetallic compound growth and mechanical properties of solder joints were investigated. Four types of surface finishes based on near eutectic SnAg alloys with different compositions and numbers of layers were analyzed. Design/methodology/approach: The effect of surface-finishes SnAg5NiP and SnAg7NiP, which were prepared with and without a Ni-P diffusion barrier, was tested. The Ni-P layer was produced either chemically or electrochemically. The effect of the SnAg surface finish on wettability, formation, and growth of intermetallic compound in the solder joint was analyzed. We further explored the impact of different PCB finishes on the quality of soldered joints. This investigation involved a comparative analysis of the behavior of SnAg finishes in comparison to pure copper, as well as the commonly employed HASL, ENIG, and ImSn finishes.Findings: It was found that SnAg surface finishes with a Ni-P diffusion barrier are wetted by molten solder faster than surface finishes without a diffusion barrier. The mechanical properties of the joints on both surfaces are comparable to those on ENIG. SnAg that include a chemically created Ni-P diffusion layer is characterized by the formation of more thermally stable ternary intermetallic compounds based on (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. On the contrary, the electrochemically formed Ni layer supports the increase in the rate of intermetallic compound formation, which affects the properties of the soldered joints.Originality: Nonstandard near-eutectic SnAg finishes, which contains a Ni-P diffusion layer can be used as promising replacement of ENIG or other standard finishes.

Druh

J_SC - Článek v periodiku v databázi SCOPUS

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Applied Surface Science Advances

ISSN

2666-5239

e-ISSN

2666-5239

Svazek periodika

18

Číslo periodika v rámci svazku

100483

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

9

Strana od-do

—

Kód UT WoS článku

001113572400001

EID výsledku v databázi Scopus

2-s2.0-85178932393