Study of influence of thermal capacity and flux activity on the solderability

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221827" target="_blank" >RIV/68407700:21230/14:00221827 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/00216208:11320/14:10290750

Výsledek na webu

<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887589&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887589&isnumber=6887550</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2014.6887589" target="_blank" >10.1109/ISSE.2014.6887589</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Study of influence of thermal capacity and flux activity on the solderability

Popis výsledku v původním jazyce

During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile duringthe soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) so

Název v anglickém jazyce

Study of influence of thermal capacity and flux activity on the solderability

Popis výsledku anglicky

During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile duringthe soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) so

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

37th Int. Spring Seminar on Electronics Technology

ISBN

978-1-4799-4455-2

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

185-188

Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Drážďany

Datum konání akce

7. 5. 2014

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000346580500037