MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU117122" target="_blank" >RIV/00216305:26220/15:PU117122 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

Popis výsledku v původním jazyce

Solderability depends on many variable factors. The main factors here are the surface finish of PCB and component terminals, the type of flux and solder alloy, the temperature profile and the surrounding atmosphere during the soldering process. This article focuses on the study of the influence of ambient and atmosphere during the soldering process. It is known that one of the main reasons of poor solderability is the presence of oxygen. Reduced oxygen concentration can increase wetability of melted solder [1], activity of the flux, etc., which results the improvement of the reliability [2], [3]. Nitrogen is common used for establishing of inert atmosphere in the soldering process. Mechanical behavior of solder joint is also changed. Paper [4] describebetter mechanical parameters achieved by soldering in inert atmosphere, for example higher shear forces of SMDs. The main aim of this work was investigation of mechanical properties of solder joint soldered under nitrogen atmosphere.

Název v anglickém jazyce

MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

Popis výsledku anglicky

Solderability depends on many variable factors. The main factors here are the surface finish of PCB and component terminals, the type of flux and solder alloy, the temperature profile and the surrounding atmosphere during the soldering process. This article focuses on the study of the influence of ambient and atmosphere during the soldering process. It is known that one of the main reasons of poor solderability is the presence of oxygen. Reduced oxygen concentration can increase wetability of melted solder [1], activity of the flux, etc., which results the improvement of the reliability [2], [3]. Nitrogen is common used for establishing of inert atmosphere in the soldering process. Mechanical behavior of solder joint is also changed. Paper [4] describebetter mechanical parameters achieved by soldering in inert atmosphere, for example higher shear forces of SMDs. The main aim of this work was investigation of mechanical properties of solder joint soldered under nitrogen atmosphere.

Druh

O - Ostatní výsledky

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů