Influence of heating direction on BGA solder balls structure

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F18%3APU127732" target="_blank" >RIV/00216305:26220/18:PU127732 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/8346878/" target="_blank" >https://ieeexplore.ieee.org/document/8346878/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.23919/EMPC.2017.8346878" target="_blank" >10.23919/EMPC.2017.8346878</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of heating direction on BGA solder balls structure

Popis výsledku v původním jazyce

The soldering of BGA packages is well known process. Despite the increasing complexity of PCBs and diversity of BGA package footprints, further optimization and improvement of soldering is required. In this paper, the influence of heat flow direction during reflow soldering on the structure of ball joint was described. The SAC305 solder alloy was used for ball joint investigation under the no-clean solder flux condition. Tested samples were made from FR4 material with ENIG as a surface finish. The heating was generated by infrared heaters placed on the top, bottom and both sides of the sample. The substantial part of this work was focused on the characterization the solder joint structure with the respect to the intermetallic compounds formation. SEM and optical microscope images of cross-sectioned solder joints were used to characterize the quality of the boundary formation. Shear test method was used to evaluate the impact of intermetallic layer and inner solder joint structure on the mechanical properties of joints. This research helps to determine the influence of the direction of heat flux, i.e. direction of heating of the infrared heater used in the reflow soldering, for the formation of the solder ball joint on BGA package (primarily for rework).

Název v anglickém jazyce

Influence of heating direction on BGA solder balls structure

Popis výsledku anglicky

The soldering of BGA packages is well known process. Despite the increasing complexity of PCBs and diversity of BGA package footprints, further optimization and improvement of soldering is required. In this paper, the influence of heat flow direction during reflow soldering on the structure of ball joint was described. The SAC305 solder alloy was used for ball joint investigation under the no-clean solder flux condition. Tested samples were made from FR4 material with ENIG as a surface finish. The heating was generated by infrared heaters placed on the top, bottom and both sides of the sample. The substantial part of this work was focused on the characterization the solder joint structure with the respect to the intermetallic compounds formation. SEM and optical microscope images of cross-sectioned solder joints were used to characterize the quality of the boundary formation. Shear test method was used to evaluate the impact of intermetallic layer and inner solder joint structure on the mechanical properties of joints. This research helps to determine the influence of the direction of heat flux, i.e. direction of heating of the infrared heater used in the reflow soldering, for the formation of the solder ball joint on BGA package (primarily for rework).

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European

ISBN

978-0-9568086-4-6

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

1-4

Název nakladatele

Neuveden

Místo vydání

Neuveden

Místo konání akce

Warsaw, Polsko

Datum konání akce

10. 9. 2017

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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