Usage of offset printing technology for printed electronics and smart labels

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU136488" target="_blank" >RIV/00216305:26220/20:PU136488 - isvavai.cz</a>

Výsledek na webu

<a href="https://tsp.vutbr.cz/datas/tsp2020/TSP2020.pdf" target="_blank" >https://tsp.vutbr.cz/datas/tsp2020/TSP2020.pdf</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Usage of offset printing technology for printed electronics and smart labels

Popis výsledku v původním jazyce

Printed electronics is key segment in modern fabrication of ultra-low-cost RFID/NFC/RF tags, smart labels, packaging, sensors etc. This paper shows the opportunity of usage of well known printing process called "offset printing" or "offset lithography". It is widely spread and well developed industry, but rarely used for printed electronics and smart tags. This work proposes usage of offset press on variety of substrates at high speed and large capacity production of printed electronics and also points to a connection of a lot of post-press technologies such as foil lamination, cutting, die-cutting, embossing, gluing etc. This additive technology provides an open door for smart packaging manufacturing, simply the RFID antenna can be printed by offset press directly on the substrate (usually paper) that is forming the box, smart label or sticker. Variety of substrates is also well maintained, offset press is usually equipped with UV, IR or hot air drying units, that enables printing on flexible substrates. More printing units also provides the technological possibility of layers overprinting.

Název v anglickém jazyce

Usage of offset printing technology for printed electronics and smart labels

Popis výsledku anglicky

Printed electronics is key segment in modern fabrication of ultra-low-cost RFID/NFC/RF tags, smart labels, packaging, sensors etc. This paper shows the opportunity of usage of well known printing process called "offset printing" or "offset lithography". It is widely spread and well developed industry, but rarely used for printed electronics and smart tags. This work proposes usage of offset press on variety of substrates at high speed and large capacity production of printed electronics and also points to a connection of a lot of post-press technologies such as foil lamination, cutting, die-cutting, embossing, gluing etc. This additive technology provides an open door for smart packaging manufacturing, simply the RFID antenna can be printed by offset press directly on the substrate (usually paper) that is forming the box, smart label or sticker. Variety of substrates is also well maintained, offset press is usually equipped with UV, IR or hot air drying units, that enables printing on flexible substrates. More printing units also provides the technological possibility of layers overprinting.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

43rd International Conference on Telecommunications and Signal Processing

ISBN

978-1-7281-6376-5

ISSN

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e-ISSN

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Počet stran výsledku

3

Strana od-do

657-659

Název nakladatele

Neuveden

Místo vydání

Neuveden

Místo konání akce

Milan, Italy

Datum konání akce

7. 7. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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