Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141159" target="_blank" >RIV/00216305:26220/21:PU141159 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9522666" target="_blank" >https://ieeexplore.ieee.org/document/9522666</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/TSP52935.2021.9522666" target="_blank" >10.1109/TSP52935.2021.9522666</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production

Popis výsledku v původním jazyce

The emerging Internet of Things (IoT) paradigm keeps pressure on constant innovation of manufacturing processes, mainly on additive technologies that can significantly reduce waste and cost of manufactured parts. Promising field for high volume, low cost and quick time to market additive fabrication method is printing. This paper briefly compares current printing technologies used for electronics fabrication, mainly for low cost Radio Frequency Identification (RFID), Near Field Communication (NFC) tags, smart labels, smart packaging, sensors etc. with focus on "offset lithography". This method raises a big challenges, one of them is chip contacting method. This work summarizes current contacting methods suitable for printed electronics on flexible substrates with focus on promising contactless RFID magnetic coupling method that does not require conductive connection between chip and antenna itself.

Název v anglickém jazyce

Conductive Printing of RFID Tag and Chip Contacting Methods for High Volume Additive Production

Popis výsledku anglicky

The emerging Internet of Things (IoT) paradigm keeps pressure on constant innovation of manufacturing processes, mainly on additive technologies that can significantly reduce waste and cost of manufactured parts. Promising field for high volume, low cost and quick time to market additive fabrication method is printing. This paper briefly compares current printing technologies used for electronics fabrication, mainly for low cost Radio Frequency Identification (RFID), Near Field Communication (NFC) tags, smart labels, smart packaging, sensors etc. with focus on "offset lithography". This method raises a big challenges, one of them is chip contacting method. This work summarizes current contacting methods suitable for printed electronics on flexible substrates with focus on promising contactless RFID magnetic coupling method that does not require conductive connection between chip and antenna itself.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

44th International Conference on Telecommunications and Signal Processing

ISBN

978-1-6654-2933-7

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

352-356

Název nakladatele

Neuveden

Místo vydání

neuveden

Místo konání akce

Brno

Datum konání akce

26. 7. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000701604600075