Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU136832" target="_blank" >RIV/00216305:26220/20:PU136832 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.fekt.vut.cz/conf/EEICT/archiv/sborniky/EEICT_2020_sbornik_1.pdf" target="_blank" >https://www.fekt.vut.cz/conf/EEICT/archiv/sborniky/EEICT_2020_sbornik_1.pdf</a>

DOI - Digital Object Identifier

—

Jazyk výsledku

angličtina

Název v původním jazyce

Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

Popis výsledku v původním jazyce

This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.

Název v anglickém jazyce

Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond

Popis výsledku anglicky

This paper deals with Free air ball (FAB) formation and its optimization. It is part of the thermocompression of the thermosonic wire bonding process. This paper consists of a theoretical introduction to the topic and specific technological steps that is crucial for correct FAB formation. Technological parameters that can have an impact on the FAB formation process were analyzed. These are for example power of the electric discharge, length of the wire tail or protective atmosphere in the case of corrosive materials of the wire. The impact of these parameters on the quality of the reliability of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of the wire bonding process for the small amount of the semiconductor chips.

Druh

O - Ostatní výsledky

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů