Filtry
Invetigation of wire bonding power interconnection
This paper deals with the investigation of wire bonding power interconnection which is very important for power application. Base part of this research is the determination of power load by the wire....
JA - Elektronika a optoelektronika, elektrotechnika
- 2010 •
- D
Rok uplatnění
D - Stať ve sborníku
The Analysis of Wire Bonding Reliability under Critical Operating Conditions
This study deals with properties of the wire bond connection under critical and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μ...
Electrical and electronic engineering
- 2020 •
- D •
- Odkaz
Rok uplatnění
D - Stať ve sborníku
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Tomography analysis of the problematics of wire joints
We used microtomography for the analysis of the wire joints made on new bonding machine. The quality of the electric bod ws evaluated and the defects were detected. The results of the analysis served for the final optimization of pr...
JI - Kompositní materiály
- 2015 •
- Vsouhrn
Rok uplatnění
Vsouhrn - Souhrnná výzkumná zpráva
Methods of Chip Interconnection
This paper describes defferent methods of chip interconnection. (Bumps, wire bonding).
JA - Elektronika a optoelektronika, elektrotechnika
- 2007 •
- D
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D - Stať ve sborníku
Optimalization and Investigation of the Free Air Ball Formation of the Gold Wire Bond
. It is part of the thermocompression of the thermosonic wire bonding process. This paper of the FAB and the wire-bonded joint were evaluated. At the end of this paper is a recommendation for the optimization of th...
Electrical and electronic engineering
- 2020 •
- O •
- Odkaz
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O - Ostatní výsledky
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Wire Bonding Power Interconnection
This work describes chip interconnection. Especially thermomechanical stressing of these structures.
JA - Elektronika a optoelektronika, elektrotechnika
- 2007 •
- D
Rok uplatnění
D - Stať ve sborníku
Dimensional analysis of the wire joints
We used micro tomography for the analysis of the wire joints made on a new bonding machine. Various dimensions were measured and the quality of the bond was evaluated. The results of the analysis were used for the optimizat...
JI - Kompositní materiály
- 2015 •
- Vsouhrn
Rok uplatnění
Vsouhrn - Souhrnná výzkumná zpráva
Workshop Wirebonding
Training of new methods in the field of contacting of semiconductor chips and sensors. Practical examples and work on a semiautomatic TPT machine. The workshop also a demonstrate of pick and place equipment, and measurement and testing wire ...
JA - Elektronika a optoelektronika, elektrotechnika
- 2015 •
- W
Rok uplatnění
W - Uspořádání workshopu
Wire-Bonds Durability in High-Temperature Applications
and reliability of wire-bonds, which are used for connection of the above-mentioned mathematical model simulated and compared differences between gold and aluminium wire-bond. for this purpose, which was subjected...
JA - Elektronika a optoelektronika, elektrotechnika
- 2013 •
- Jx
Rok uplatnění
Jx - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
Electrothermal simulation of bonding wire degradation under uncertain geometries
Integration Technique (FIT). In particular, the design of bonding wires with respect to thermal degradation is investigated. Instead of resolving the wires to uncertainties of the wires' parameters and influence t...
Electrical and electronic engineering
- 2016 •
- D •
- Odkaz
Rok uplatnění
D - Stať ve sborníku
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