Adhesion evaluation of a-SiC:H thin films on silicon wafers using the nanoscratch testing technique

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26310%2F17%3APU125372" target="_blank" >RIV/00216305:26310/17:PU125372 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.empa.ch/web/s606/phd-symposium-2017" target="_blank" >https://www.empa.ch/web/s606/phd-symposium-2017</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Adhesion evaluation of a-SiC:H thin films on silicon wafers using the nanoscratch testing technique

Popis výsledku v původním jazyce

Scratch testing is the most commonly technique for assessing the adhesion of thin films to the substrates and determining its application possibilities. Planar silicon wafers were pretreated with argon plasma using continuous wave for 10 min to clean the surface from adsorbed gases and reach reproducible adhesion of films. Thin films of hydrogenated amorphous carbon-silicon (a-SiC:H) were deposited from tetravinylsilane (TVS) monomer (pulsed plasma with effective power in range 2 – 150 W) on wafers by plasma enhanced chemical vapor deposition (PECVD). Films of 0.1 μm thickness were tested by scratch test using a conical diamond tip (radius of 1 μm) with the peak load up to 10mN and using 10 μm scratch length. Good reproducibility of the film adhesion was found for the individual depositions. No significant effect of loading rate ranging from 4 to 20 mN/min was observed. We revealed that the critical load increased with enhanced power from 1.6mN (2 W) up to 4.6mN (75 W) and was invariable for higher po

Název v anglickém jazyce

Adhesion evaluation of a-SiC:H thin films on silicon wafers using the nanoscratch testing technique

Popis výsledku anglicky

Scratch testing is the most commonly technique for assessing the adhesion of thin films to the substrates and determining its application possibilities. Planar silicon wafers were pretreated with argon plasma using continuous wave for 10 min to clean the surface from adsorbed gases and reach reproducible adhesion of films. Thin films of hydrogenated amorphous carbon-silicon (a-SiC:H) were deposited from tetravinylsilane (TVS) monomer (pulsed plasma with effective power in range 2 – 150 W) on wafers by plasma enhanced chemical vapor deposition (PECVD). Films of 0.1 μm thickness were tested by scratch test using a conical diamond tip (radius of 1 μm) with the peak load up to 10mN and using 10 μm scratch length. Good reproducibility of the film adhesion was found for the individual depositions. No significant effect of loading rate ranging from 4 to 20 mN/min was observed. We revealed that the critical load increased with enhanced power from 1.6mN (2 W) up to 4.6mN (75 W) and was invariable for higher po

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

10403 - Physical chemistry

Projekt

<a href="/cs/project/GA16-09161S" target="_blank" >GA16-09161S: Syntéza multifunkčních plazmových polymerů pro polymerní kompozity bez rozhraní</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů