Near threshold fatigue crack growth in ultrafinegrained copper

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F14%3APU111344" target="_blank" >RIV/00216305:26620/14:PU111344 - isvavai.cz</a>

Výsledek na webu

<a href="http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158" target="_blank" >http://iopscience.iop.org/article/10.1088/1757-899X/63/1/012158</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1088/1757-899X/63/1/012158" target="_blank" >10.1088/1757-899X/63/1/012158</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Near threshold fatigue crack growth in ultrafinegrained copper

Popis výsledku v původním jazyce

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at <K > 7 MPa@m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude <Keff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.

Název v anglickém jazyce

Near threshold fatigue crack growth in ultrafinegrained copper

Popis výsledku anglicky

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at <K > 7 MPa@m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude <Keff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20306 - Audio engineering, reliability analysis

Projekt

<a href="/cs/project/EE2.3.30.0039" target="_blank" >EE2.3.30.0039: Excelentní mladí vědci na VUT v Brně</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IOP Conference Series: Materials Science and Engineering

ISSN

1757-8981

e-ISSN

—

Svazek periodika

63

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

9

Strana od-do

1-9

Kód UT WoS článku

000347246200159

EID výsledku v databázi Scopus

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