Near threshold fatigue crack growth in ultrafine-grained copper

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F14%3A00484637" target="_blank" >RIV/68081723:_____/14:00484637 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1088/1757-899X/63/1/012158" target="_blank" >http://dx.doi.org/10.1088/1757-899X/63/1/012158</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1088/1757-899X/63/1/012158" target="_blank" >10.1088/1757-899X/63/1/012158</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Near threshold fatigue crack growth in ultrafine-grained copper

Popis výsledku v původním jazyce

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at Delta K <= 7 MPa root m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude Delta K-eff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.

Název v anglickém jazyce

Near threshold fatigue crack growth in ultrafine-grained copper

Popis výsledku anglicky

The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at Delta K <= 7 MPa root m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude Delta K-eff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20306 - Audio engineering, reliability analysis

Projekt

<a href="/cs/project/GAP108%2F10%2F2001" target="_blank" >GAP108/10/2001: Cyklická plastická deformace a únavové vlastnosti ultrajemnozrnných materiálů</a><br>

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

6TH INTERNATIONAL CONFERENCE ON NANOMATERIALS BY SEVERE PLASTIC DEFORMATION (NANOSPD6)

ISBN

—

ISSN

1757-8981

e-ISSN

—

Počet stran výsledku

9

Strana od-do

—

Název nakladatele

IOP PUBLISHING LTD

Místo vydání

Bristol

Místo konání akce

Metz

Datum konání akce

30. 6. 2014

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

000347246200159