State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F23%3APU149028" target="_blank" >RIV/00216305:26620/23:PU149028 - isvavai.cz</a>

Výsledek na webu

<a href="https://onlinelibrary.wiley.com/doi/10.1002/aelm.202300258" target="_blank" >https://onlinelibrary.wiley.com/doi/10.1002/aelm.202300258</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1002/aelm.202300258" target="_blank" >10.1002/aelm.202300258</a>

Jazyk výsledku

angličtina

Název v původním jazyce

State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

Popis výsledku v původním jazyce

This review is dedicated to electronics materials enabling thin-film-based neural interface and bioelectronics devices. First-generation bioelectronic medicine devices feature hand-crafted bulk interface electrodes, wires and interconnects, and insulators. This review discusses how modern materials science, especially know-how repurposed from semiconductor and microdevice technologies, enables next-generation bioelectronics. Those are divided into two subgroups: second and third generation. The former refers to rigid microscaled devices, while the latter is defined as soft, ultrathin, and flexible microdevices. A critical assessment of different biointerface electrodes, conductors for interconnects, and insulators for substrates, passivation, and encapsulation layers is made. The goal is not to give an exhaustive account of every use-example of given materials, but to point out specific aspects that are relevant to making the right choices for materials for a given device or application. Unique advantages of specific materials are highlighted, while also focusing on weaker points and caveats that those materials may have. The goal is to have an up-to-date handbook for persons entering the field which also points out tips and tricks as well as challenging problems that researchers can be inspired to confront and overcome.

Název v anglickém jazyce

State-of-the-Art Electronic Materials for Thin Films in Bioelectronics

Popis výsledku anglicky

This review is dedicated to electronics materials enabling thin-film-based neural interface and bioelectronics devices. First-generation bioelectronic medicine devices feature hand-crafted bulk interface electrodes, wires and interconnects, and insulators. This review discusses how modern materials science, especially know-how repurposed from semiconductor and microdevice technologies, enables next-generation bioelectronics. Those are divided into two subgroups: second and third generation. The former refers to rigid microscaled devices, while the latter is defined as soft, ultrathin, and flexible microdevices. A critical assessment of different biointerface electrodes, conductors for interconnects, and insulators for substrates, passivation, and encapsulation layers is made. The goal is not to give an exhaustive account of every use-example of given materials, but to point out specific aspects that are relevant to making the right choices for materials for a given device or application. Unique advantages of specific materials are highlighted, while also focusing on weaker points and caveats that those materials may have. The goal is to have an up-to-date handbook for persons entering the field which also points out tips and tricks as well as challenging problems that researchers can be inspired to confront and overcome.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

21000 - Nano-technology

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Advanced Electronic Materials

ISSN

2199-160X

e-ISSN

—

Svazek periodika

9

Číslo periodika v rámci svazku

8

Stát vydavatele periodika

DE - Spolková republika Německo

Počet stran výsledku

23

Strana od-do

1-23

Kód UT WoS článku

001024523900001

EID výsledku v databázi Scopus

2-s2.0-85164117301