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Optimization of the continuity of the aspherical production processes in asphericon s.r.o based on subsurface damage and microroughness analysis

Identifikátory výsledku

  • Kód výsledku v IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F04670361%3A_____%2F21%3AN0000001" target="_blank" >RIV/04670361:_____/21:N0000001 - isvavai.cz</a>

  • Výsledek na webu

  • DOI - Digital Object Identifier

Alternativní jazyky

  • Jazyk výsledku

    angličtina

  • Název v původním jazyce

    Optimization of the continuity of the aspherical production processes in asphericon s.r.o based on subsurface damage and microroughness analysis

  • Popis výsledku v původním jazyce

    In the paper is presented an analysis and optimization of the standardized sub-apertural grinding process used in the serial production in asphericon s.r.o. The monitored parameter was the depth of subsurface damage and surface microroughness. Tested were five grinding processes, which were automatically generated by the internal system, for five different diamond grit sizes (D151, D91, D64, D30, and D15). For evaluation of the depth of the defected layer was used modified wedge polishing method which is suitable for analysis of the rotationally symmetrical sub-apertural grinding processes [1]. For identifying the presence of the subsurface damage two methods were used. Defect detection using an optical microscope, as the broadly used and reliable method, and detection by standard ISO control to get the comparison with the method used in common serial production. The microroughness was measured using a white-light microscope concerning the used grinding tool and the amount of removed material. Within the experiment was found as the most effective two-step process uses D91 for rough grinding and D30 for fine grinding. D91 provides a very good removal characteristic with final subsurface damage of 44 µm which is possible to grind out using the D30 tool in two steps with final subsurface damage 22 µm in a total processing time of 137 minutes. This grinding process is timewise in best balance with 80 minutes long polishing process and therefore minimize the production cost. Result microroughness around 2 nm Sq in the fully polished zone is already limited by the polishing process. Using a finer grinding tool is not bringing improvement in the surface microroughness just shortening polishing time due to lower subsurface damage.

  • Název v anglickém jazyce

    Optimization of the continuity of the aspherical production processes in asphericon s.r.o based on subsurface damage and microroughness analysis

  • Popis výsledku anglicky

    In the paper is presented an analysis and optimization of the standardized sub-apertural grinding process used in the serial production in asphericon s.r.o. The monitored parameter was the depth of subsurface damage and surface microroughness. Tested were five grinding processes, which were automatically generated by the internal system, for five different diamond grit sizes (D151, D91, D64, D30, and D15). For evaluation of the depth of the defected layer was used modified wedge polishing method which is suitable for analysis of the rotationally symmetrical sub-apertural grinding processes [1]. For identifying the presence of the subsurface damage two methods were used. Defect detection using an optical microscope, as the broadly used and reliable method, and detection by standard ISO control to get the comparison with the method used in common serial production. The microroughness was measured using a white-light microscope concerning the used grinding tool and the amount of removed material. Within the experiment was found as the most effective two-step process uses D91 for rough grinding and D30 for fine grinding. D91 provides a very good removal characteristic with final subsurface damage of 44 µm which is possible to grind out using the D30 tool in two steps with final subsurface damage 22 µm in a total processing time of 137 minutes. This grinding process is timewise in best balance with 80 minutes long polishing process and therefore minimize the production cost. Result microroughness around 2 nm Sq in the fully polished zone is already limited by the polishing process. Using a finer grinding tool is not bringing improvement in the surface microroughness just shortening polishing time due to lower subsurface damage.

Klasifikace

  • Druh

    D - Stať ve sborníku

  • CEP obor

  • OECD FORD obor

    20501 - Materials engineering

Návaznosti výsledku

  • Projekt

    <a href="/cs/project/FX01030046" target="_blank" >FX01030046: Zavedení inteligentního PMS pro výrobu přesné asférické optiky</a><br>

  • Návaznosti

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Ostatní

  • Rok uplatnění

    2021

  • Kód důvěrnosti údajů

    C - Předmět řešení projektu podléhá obchodnímu tajemství (§ 504 Občanského zákoníku), ale název projektu, cíle projektu a u ukončeného nebo zastaveného projektu zhodnocení výsledku řešení projektu (údaje P03, P04, P15, P19, P29, PN8) dodané do CEP, jsou upraveny tak, aby byly zveřejnitelné.

Údaje specifické pro druh výsledku

  • Název statě ve sborníku

    EFM21 – 15th International Conference “Experimental Fluid Mechanics 2021

  • ISBN

  • ISSN

    2100-014X

  • e-ISSN

    2100-014X

  • Počet stran výsledku

    7

  • Strana od-do

  • Název nakladatele

  • Místo vydání

    Liberec

  • Místo konání akce

    Liberec

  • Datum konání akce

    23. 11. 2021

  • Typ akce podle státní příslušnosti

    EUR - Evropská akce

  • Kód UT WoS článku