Embedded components in Photovia Substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F12%3A43915605" target="_blank" >RIV/49777513:23220/12:43915605 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ESTC.2012.6542190" target="_blank" >http://dx.doi.org/10.1109/ESTC.2012.6542190</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ESTC.2012.6542190" target="_blank" >10.1109/ESTC.2012.6542190</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Embedded components in Photovia Substrates

Popis výsledku v původním jazyce

This paper deals with the research and development of high density interconnection (HDI) substrates and passive components embedded into HDI substrates. Both HDI substrates and passive embedded components are fully formed by the photolithography method.The manufacturing process consists of screen printing process used for individual layers deposition and photolithography process for all layers structuring. The photosensitive dielectric material, used in these HDI substrates, was specially designed forthis application and consists of photoimageable photopolymer and ceramic filler. The manufacturing process of HDI substrates with embedded components was specified and verified. Impedance to frequency characteristic, capacity to temperature and capacityto voltage characteristic of embedded capacitors were measured in detail. Impedance to frequency characteristics were also measured for embedded inductors. Electrical parameters of embedded components were calculated as well.

Název v anglickém jazyce

Embedded components in Photovia Substrates

Popis výsledku anglicky

This paper deals with the research and development of high density interconnection (HDI) substrates and passive components embedded into HDI substrates. Both HDI substrates and passive embedded components are fully formed by the photolithography method.The manufacturing process consists of screen printing process used for individual layers deposition and photolithography process for all layers structuring. The photosensitive dielectric material, used in these HDI substrates, was specially designed forthis application and consists of photoimageable photopolymer and ceramic filler. The manufacturing process of HDI substrates with embedded components was specified and verified. Impedance to frequency characteristic, capacity to temperature and capacityto voltage characteristic of embedded capacitors were measured in detail. Impedance to frequency characteristics were also measured for embedded inductors. Electrical parameters of embedded components were calculated as well.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ESTC2012

ISBN

978-1-4673-4644-3

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

345 E 47TH ST, NEW YORK, NY 10017 USA

Místo konání akce

Amstrdam

Datum konání akce

17. 9. 2012

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000324550400139