Bending endurance of printed conductive patterns on flexible substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43928896" target="_blank" >RIV/49777513:23220/16:43928896 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/document/7563185/" target="_blank" >http://ieeexplore.ieee.org/document/7563185/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2016.7563185" target="_blank" >10.1109/ISSE.2016.7563185</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Bending endurance of printed conductive patterns on flexible substrates

Popis výsledku v původním jazyce

This paper presents a research focused on the testing of flexible and printed components' mechanical properties. The flexibility and the bending endurance are the crucial properties for the production of smart labels and tags for smart packages. For these reasons, the presented research was concentrated on the development of bend test apparatus, as well as, on the specification and optimization of testing procedures. These procedures were verified on specially designed conductive test patterns manufactured by the use of three different technologies - standard flexible PCB manufacturing, screen printing of Ag pastes and Aerosol Jet(R) printing of Ag ink. Electrical parameters of test patterns were measured online and offline during the testing. The influences of test samples' electrical resistance on the number of bend cycles for different bending radiuses are described in this paper.

Název v anglickém jazyce

Bending endurance of printed conductive patterns on flexible substrates

Popis výsledku anglicky

This paper presents a research focused on the testing of flexible and printed components' mechanical properties. The flexibility and the bending endurance are the crucial properties for the production of smart labels and tags for smart packages. For these reasons, the presented research was concentrated on the development of bend test apparatus, as well as, on the specification and optimization of testing procedures. These procedures were verified on specially designed conductive test patterns manufactured by the use of three different technologies - standard flexible PCB manufacturing, screen printing of Ag pastes and Aerosol Jet(R) printing of Ag ink. Electrical parameters of test patterns were measured online and offline during the testing. The influences of test samples' electrical resistance on the number of bend cycles for different bending radiuses are described in this paper.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2016)

ISBN

978-1-5090-1389-0

ISSN

—

e-ISSN

—

Počet stran výsledku

5

Strana od-do

184-188

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pilsen, Czech Republic

Datum konání akce

18. 5. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000387089800036