Interconnection of terminals on flexible substrates with printed conductive patterns

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F20%3A43958896" target="_blank" >RIV/49777513:23220/20:43958896 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9120956" target="_blank" >https://ieeexplore.ieee.org/document/9120956</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120956" target="_blank" >10.1109/ISSE49702.2020.9120956</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Interconnection of terminals on flexible substrates with printed conductive patterns

Popis výsledku v původním jazyce

This paper presents research focused on realisation and the testing of wire to Ag printed pad interconnections realised on flexible substrates. The research was concentrated mainly on the development of highly reliable resistance spot welded interconnection technology. The mechanically crimped contacts on the same test patterns were also realised for the comparison purposes. Realised interconnections were deeply tested in terms of 4-wire contact resistance measurement before, during and after climatic ageing. Two different flexible substrates and three wire finish metals (Cu, Sn, Ag) were used for the resistance spot welding process. The changes of test samples contact resistance during the dry heat test and damp heat test are described in the paper. It can be concluded that the resistance spot welding process can produce high reliable interconnections between wires and Ag printed terminals on flexible substrates. This technology is scalable to mass production, is low cost and properties of realised interconnections are comparable to conventional crimped interconnections.

Název v anglickém jazyce

Interconnection of terminals on flexible substrates with printed conductive patterns

Popis výsledku anglicky

This paper presents research focused on realisation and the testing of wire to Ag printed pad interconnections realised on flexible substrates. The research was concentrated mainly on the development of highly reliable resistance spot welded interconnection technology. The mechanically crimped contacts on the same test patterns were also realised for the comparison purposes. Realised interconnections were deeply tested in terms of 4-wire contact resistance measurement before, during and after climatic ageing. Two different flexible substrates and three wire finish metals (Cu, Sn, Ag) were used for the resistance spot welding process. The changes of test samples contact resistance during the dry heat test and damp heat test are described in the paper. It can be concluded that the resistance spot welding process can produce high reliable interconnections between wires and Ag printed terminals on flexible substrates. This technology is scalable to mass production, is low cost and properties of realised interconnections are comparable to conventional crimped interconnections.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF18_069%2F0009855" target="_blank" >EF18_069/0009855: Elektrotechnické technologie s vysokým podílem vestavěné inteligence</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology, ISSE 2020

ISBN

978-1-72816-773-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Web-based Conference, Demenovska, Slovakia

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000610543500023