Nanoparticle based ink printed chip interconnections

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43931848" target="_blank" >RIV/49777513:23220/17:43931848 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/document/8000912/" target="_blank" >http://ieeexplore.ieee.org/document/8000912/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2017.8000912" target="_blank" >10.1109/ISSE.2017.8000912</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Nanoparticle based ink printed chip interconnections

Popis výsledku v původním jazyce

This paper presents a research focused on Aerosol Jet interconnecting of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies the new possibilities have raised. Without using of conductive adhesives the Aerosol Jet technology can be used for contacting. The interconnections were realized by silver nanoparticle ink. Two possible options were examined - direct interconnecting and interconnecting with dielectric blob. Issues of the Aerosol Jet interconnecting, used materials and measured data are discussed in the paper.

Název v anglickém jazyce

Nanoparticle based ink printed chip interconnections

Popis výsledku anglicky

This paper presents a research focused on Aerosol Jet interconnecting of SMD components to flexible substrates. Flexible printed electronics is becoming important fast growing market segment. Contacting technologies of the electronic components are well known for traditional electronics such as soldering, welding, conductive adhesive bonding, however in the expansion of direct printing technologies the new possibilities have raised. Without using of conductive adhesives the Aerosol Jet technology can be used for contacting. The interconnections were realized by silver nanoparticle ink. Two possible options were examined - direct interconnecting and interconnecting with dielectric blob. Issues of the Aerosol Jet interconnecting, used materials and measured data are discussed in the paper.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2017)

ISBN

978-1-5386-0582-0

ISSN

—

e-ISSN

neuvedeno

Počet stran výsledku

4

Strana od-do

1-4

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Sofia, Bulgaria

Datum konání akce

10. 5. 2017

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—