Influence of flexible substrate roughness with Aerosol Jet printed pads on the mechanical shear strength of glued joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F17%3A43931844" target="_blank" >RIV/49777513:23220/17:43931844 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/document/8000911/" target="_blank" >http://ieeexplore.ieee.org/document/8000911/</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2017.8000911" target="_blank" >10.1109/ISSE.2017.8000911</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of flexible substrate roughness with Aerosol Jet printed pads on the mechanical shear strength of glued joints

Popis výsledku v původním jazyce

This paper presents a research focused on Aerosol Jet printed pads adhesion improvement for electrically conductive adhesives (ECA) testing. The Aerosol Jet technology is able to use nanoparticle inks for deposition process. The adhesion of the ink to the substrate is crucial especially when you realize printing on flexible substrates. The paper will show a new method of adhesion improvement by plasma treatment and fine sandpaper grinding. The adhesion testing was realized by shear strength test of glued joints. Ten SMD chip resistors 1206 were mounted to the electrically conductive adhesive on aerosol jet printed pads for each sample. The advantages, disadvantages and full results of adhesion improvement method are discussed in the paper.

Název v anglickém jazyce

Influence of flexible substrate roughness with Aerosol Jet printed pads on the mechanical shear strength of glued joints

Popis výsledku anglicky

This paper presents a research focused on Aerosol Jet printed pads adhesion improvement for electrically conductive adhesives (ECA) testing. The Aerosol Jet technology is able to use nanoparticle inks for deposition process. The adhesion of the ink to the substrate is crucial especially when you realize printing on flexible substrates. The paper will show a new method of adhesion improvement by plasma treatment and fine sandpaper grinding. The adhesion testing was realized by shear strength test of glued joints. Ten SMD chip resistors 1206 were mounted to the electrically conductive adhesive on aerosol jet printed pads for each sample. The advantages, disadvantages and full results of adhesion improvement method are discussed in the paper.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/LO1607" target="_blank" >LO1607: RICE – Nové technologie a koncepce pro inteligentní průmyslové systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar of Electronics Technology (ISSE 2017)

ISBN

978-1-5386-0582-0

ISSN

—

e-ISSN

neuvedeno

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Sofia, Bulgaria

Datum konání akce

10. 5. 2017

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—