Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F22%3A43965455" target="_blank" >RIV/49777513:23220/22:43965455 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9812714" target="_blank" >https://ieeexplore.ieee.org/document/9812714</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812714" target="_blank" >10.1109/ISSE54558.2022.9812714</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles

Popis výsledku v původním jazyce

This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.

Název v anglickém jazyce

Method of Connecting Printed and Embroidered Conductive Paths in Smart Textiles

Popis výsledku anglicky

This paper proposes a method of connecting conductive paths realized by embroidering and printing in smart textiles. The embroidering of conductive threads offers great electrical conductivity and the level of integration while technologies of printed electronics offer the realization of fine details. Connection is realized by overstitch of the printed contact pad. The durability of the connection is further improved with overprinting with conductive paste and encapsulation by lamination. Contact resistance and its change during the cyclic mechanical stress test and thermal shock test is measured. The proposed connection shows reliability during the thermal shock test as contact resistance is not affected. Also, during the cyclic mechanical stress test, the reliability and durability are observed.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 45th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66546-589-2

ISSN

2161-2536

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Vienna, Austria

Datum konání akce

11. 5. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853642200006