Thermal Cycle Testing of Printed Circuit Board Vias (Barrel Plates)
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00325945" target="_blank" >RIV/68407700:21230/18:00325945 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Thermal Cycle Testing of Printed Circuit Board Vias (Barrel Plates)
Popis výsledku v původním jazyce
Printed circuit board (PCB) reliability is a very important factor from the point of total quality of output products. The ambient environment has influence on the reliability of PCBs and various issues can appear during its lifetime, even if the PCB properly passes the quality control before and after its assembly. This article deals with reliability test-monitoring of resistance behavior of the printed circuit board vias (barrel plates) during thermal stress (shock test). Appropriate printed circuit boards have been designed for this purpose. PCB sample was double-sided, vias were connected serially and PCB design allowed the use of four wire measurement method for measuring of all vias at once. The temperature sensor Pt100 was attached onto the PCB for better temperature monitoring of PCB during shock test. The shock test cycle took 20 minutes, the temperature of hot zone was set to 160 degrees C and the temperature of cool zone was -60 degrees C. The experiments help in understanding the barrel plate behavior during thermal stress, when the thermal expansion of composite substrate (glass-epoxy laminate) cause force (Young's modules), which stretches the barrel plate from the middle outwards. The identification of faulty vias is not easy during ambient temperature, it is easier when a measurement is conducted during thermal cycling or when the PCB is heated.
Název v anglickém jazyce
Thermal Cycle Testing of Printed Circuit Board Vias (Barrel Plates)
Popis výsledku anglicky
Printed circuit board (PCB) reliability is a very important factor from the point of total quality of output products. The ambient environment has influence on the reliability of PCBs and various issues can appear during its lifetime, even if the PCB properly passes the quality control before and after its assembly. This article deals with reliability test-monitoring of resistance behavior of the printed circuit board vias (barrel plates) during thermal stress (shock test). Appropriate printed circuit boards have been designed for this purpose. PCB sample was double-sided, vias were connected serially and PCB design allowed the use of four wire measurement method for measuring of all vias at once. The temperature sensor Pt100 was attached onto the PCB for better temperature monitoring of PCB during shock test. The shock test cycle took 20 minutes, the temperature of hot zone was set to 160 degrees C and the temperature of cool zone was -60 degrees C. The experiments help in understanding the barrel plate behavior during thermal stress, when the thermal expansion of composite substrate (glass-epoxy laminate) cause force (Young's modules), which stretches the barrel plate from the middle outwards. The identification of faulty vias is not easy during ambient temperature, it is easier when a measurement is conducted during thermal cycling or when the PCB is heated.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
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OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
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Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2018
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2018 41st International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-3-319-73847-5
ISSN
2161-2536
e-ISSN
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Počet stran výsledku
4
Strana od-do
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Název nakladatele
IEEE
Místo vydání
NEW YORK, NY
Místo konání akce
Zlatibor, Serbia
Datum konání akce
16. 5. 2018
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000449866600005