Modeling of the ecological separation process of printed circuit boards

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27230%2F18%3A10243151" target="_blank" >RIV/61989100:27230/18:10243151 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/70883521:28140/18:63520653

Výsledek na webu

<a href="http://dx.doi.org/10.1051/matecconf/201821001004" target="_blank" >http://dx.doi.org/10.1051/matecconf/201821001004</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1051/matecconf/201821001004" target="_blank" >10.1051/matecconf/201821001004</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Modeling of the ecological separation process of printed circuit boards

Popis výsledku v původním jazyce

The content of this paper is the modeling of the stress in the printed circuit board due to the cyclic thermal stress for its ecological recycling. Cyclic thermal stresses result in separation of copper conduction paths and plastic plates due to different longitudinal expansion. For separation, it was important to determine the minimum temperature of the cyclical changes to separate the conductive copper paths and the plastic. We use mathematical modeling tools to describe the course of temperature fields in the PCB during heating and reheating. We conducted some simulation experiments in the Pro/ENGINEER programming environment to know the waveforms and stresses of the PCBs during the cyclic loading cycle. From experiments conducted in the laboratory, we have verified that the process of temperature separation is feasible for designing an eco-friendly way of recycling PCBs. (C) 2018 The Authors, published by EDP Sciences.

Název v anglickém jazyce

Modeling of the ecological separation process of printed circuit boards

Popis výsledku anglicky

The content of this paper is the modeling of the stress in the printed circuit board due to the cyclic thermal stress for its ecological recycling. Cyclic thermal stresses result in separation of copper conduction paths and plastic plates due to different longitudinal expansion. For separation, it was important to determine the minimum temperature of the cyclical changes to separate the conductive copper paths and the plastic. We use mathematical modeling tools to describe the course of temperature fields in the PCB during heating and reheating. We conducted some simulation experiments in the Pro/ENGINEER programming environment to know the waveforms and stresses of the PCBs during the cyclic loading cycle. From experiments conducted in the laboratory, we have verified that the process of temperature separation is feasible for designing an eco-friendly way of recycling PCBs. (C) 2018 The Authors, published by EDP Sciences.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20301 - Mechanical engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

MATEC Web of Conferences

ISBN

—

ISSN

2261-236X

e-ISSN

—

Počet stran výsledku

4

Strana od-do

4

Název nakladatele

EDP Sciences

Místo vydání

Paříž

Místo konání akce

Majorca, Spain

Datum konání akce

14. 7. 2018

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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