Dividing of metal and plastic components of printed circuit boards

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F17%3A63517296" target="_blank" >RIV/70883521:28110/17:63517296 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/70883521:28140/17:63517296

Výsledek na webu

<a href="https://www.matec-conferences.org/articles/matecconf/pdf/2017/39/matecconf_cscc2017_02040.pdf" target="_blank" >https://www.matec-conferences.org/articles/matecconf/pdf/2017/39/matecconf_cscc2017_02040.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1051/matecconf/201712502040" target="_blank" >10.1051/matecconf/201712502040</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Dividing of metal and plastic components of printed circuit boards

Popis výsledku v původním jazyce

This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis of the problem. The separation of metal and plastic may occur due to temperature changes if the temperature difference is sufficient. We have carried out a study of printed circuit board production so we can choose the appropriate path of separation. Furthermore, we calculated the shear stress size required to tear the conductive copper paths from the epoxy resin. The temperature field in a two-layer board was modeled in the FEMLAB and Pro/ENGINEER programming environments. From the simulated temperature field simulations, conclusions can be drawn that accurately describe the condition and characteristics of materials subjected to heat shock. They derived the resulting relationship for calculating the resulting shear stress needed to separate the conductive paths and plastic materials of the PCB. In our own experiments, we used several ways to heat PCBs. The temperature is also sufficient for the separation of tin. After using the mechanical separation of the components, they were dropped from the PCB. Mechanical separation was also used when removing conductive paths. This separation is effective, but in the newer types of PCBs, the cyclical effects of thermal shock have to be applied to the separation of copper paths. Laboratory tests have demonstrated the viability of the proposed solution. The proposed method of recycling could lead to industrial use, which requires consistent sorting of waste electrical and electronic equipment.

Název v anglickém jazyce

Dividing of metal and plastic components of printed circuit boards

Popis výsledku anglicky

This paper contents one possibility of PCB separation due to the temperature due to the different thermal expansion of the metal path and the plastic from which the boards are made. Using the knowledge from the literary study and the simulation environments used, we have reached the maximum analysis of the problem. The separation of metal and plastic may occur due to temperature changes if the temperature difference is sufficient. We have carried out a study of printed circuit board production so we can choose the appropriate path of separation. Furthermore, we calculated the shear stress size required to tear the conductive copper paths from the epoxy resin. The temperature field in a two-layer board was modeled in the FEMLAB and Pro/ENGINEER programming environments. From the simulated temperature field simulations, conclusions can be drawn that accurately describe the condition and characteristics of materials subjected to heat shock. They derived the resulting relationship for calculating the resulting shear stress needed to separate the conductive paths and plastic materials of the PCB. In our own experiments, we used several ways to heat PCBs. The temperature is also sufficient for the separation of tin. After using the mechanical separation of the components, they were dropped from the PCB. Mechanical separation was also used when removing conductive paths. This separation is effective, but in the newer types of PCBs, the cyclical effects of thermal shock have to be applied to the separation of copper paths. Laboratory tests have demonstrated the viability of the proposed solution. The proposed method of recycling could lead to industrial use, which requires consistent sorting of waste electrical and electronic equipment.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

MATEC Web of Conferences

ISBN

—

ISSN

2261-236X

e-ISSN

neuvedeno

Počet stran výsledku

5

Strana od-do

"nestrankovano"

Název nakladatele

EDP Sciences

Místo vydání

Les Ulis

Místo konání akce

Heraklion, Crete

Datum konání akce

14. 7. 2017

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—