Simulation of printed circuit boards recycling process

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F19%3A63522884" target="_blank" >RIV/70883521:28140/19:63522884 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.matec-conferences.org/articles/matecconf/pdf/2019/41/matecconf_cscc2019_01040.pdf" target="_blank" >https://www.matec-conferences.org/articles/matecconf/pdf/2019/41/matecconf_cscc2019_01040.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1051/matecconf/201929201040" target="_blank" >10.1051/matecconf/201929201040</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Simulation of printed circuit boards recycling process

Popis výsledku v původním jazyce

This paper focused on the modeling of ecological PCB. Due to the high increase in the production of electronic waste, which contains a whole range of usable components, it is necessary to recycle it. About the study of the issue, we have proposed a solution for the separation of conductive paths from plastic and taking into account the legislative approaches and taking into account the existing methods of PCB separation, the composition, and production of PCBs and also the binders used in PCBs. We used the knowledge of process engineering to design a mathematical description of temperature fields in PCB and stress. To a great extent, we have devoted ourselves to the simulation experiments of PCB heating and cooling and the determination of temperature fields and stress due to temperature, cyclic mechanical stresses due to temperature. The simulation is performed in the Pro/ENGINEER and COMSOL Multiphysics® software environments, because of the possibility of solving multi-physical problems. Outputs from computer simulations are the initial stage for designing an eco-friendly way of recycling PCBs. In the future, we will focus on the more difficult issue of recycling multilayer PCBs. The development of new criteria for PCB recycling has opened new possibilities of treatment for used materials.

Název v anglickém jazyce

Simulation of printed circuit boards recycling process

Popis výsledku anglicky

This paper focused on the modeling of ecological PCB. Due to the high increase in the production of electronic waste, which contains a whole range of usable components, it is necessary to recycle it. About the study of the issue, we have proposed a solution for the separation of conductive paths from plastic and taking into account the legislative approaches and taking into account the existing methods of PCB separation, the composition, and production of PCBs and also the binders used in PCBs. We used the knowledge of process engineering to design a mathematical description of temperature fields in PCB and stress. To a great extent, we have devoted ourselves to the simulation experiments of PCB heating and cooling and the determination of temperature fields and stress due to temperature, cyclic mechanical stresses due to temperature. The simulation is performed in the Pro/ENGINEER and COMSOL Multiphysics® software environments, because of the possibility of solving multi-physical problems. Outputs from computer simulations are the initial stage for designing an eco-friendly way of recycling PCBs. In the future, we will focus on the more difficult issue of recycling multilayer PCBs. The development of new criteria for PCB recycling has opened new possibilities of treatment for used materials.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20205 - Automation and control systems

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

MATEC Web of Conferences 292

ISBN

—

ISSN

2261-236X

e-ISSN

—

Počet stran výsledku

4

Strana od-do

1-4

Název nakladatele

EDP Sciences

Místo vydání

Les Ulis

Místo konání akce

Athens

Datum konání akce

14. 7. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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