Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973008" target="_blank" >RIV/49777513:23220/24:43973008 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10676067" target="_blank" >https://ieeexplore.ieee.org/document/10676067</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ICHVE61955.2024.10676067" target="_blank" >10.1109/ICHVE61955.2024.10676067</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

Popis výsledku v původním jazyce

This study is part of a comprehensive research project aimed at developing innovative composite materials by leveraging the advantageous properties of nanofillers. This paper focus on the dielectric properties of a new composite composed of polyesterimide resin with 1wt.% silicon dioxide (SiO2) nanoparticles, polyamide nonwoven nanofabric, and polyamide film. The dielectric properties are thoroughly evaluated using several key parameters: absorption/resorption currents and their derivative metrics, relative permittivity, dissipation factor across varied temperatures and frequencies, and dielectric strength. These metrics are crucial for assessing the composite’s performance under various electrical and temperature stresses, essential for high-voltage applications. The outcome is a novel four-component material with enhanced dielectric properties compared to traditional composites. Polyamide nonwoven nanofabric significantly improved dielectric strength without compromising other dielectric parameters. On the other hand, polyamide film served as the carrier material that enhanced mechanical properties, which are discussed in a separate paper. This material could potentially replace conventional insulating materials in specific applications, thanks to its enhanced performance and reliability. A significant advantage of used resin is its VOC-free nature and low viscosity, which facilitate easy impregnation and effective dispersion of nanoparticles.

Název v anglickém jazyce

Novel Polyesterimide-SiO2-Polyamide Nanocomposites and Their Dielectric Properties

Popis výsledku anglicky

This study is part of a comprehensive research project aimed at developing innovative composite materials by leveraging the advantageous properties of nanofillers. This paper focus on the dielectric properties of a new composite composed of polyesterimide resin with 1wt.% silicon dioxide (SiO2) nanoparticles, polyamide nonwoven nanofabric, and polyamide film. The dielectric properties are thoroughly evaluated using several key parameters: absorption/resorption currents and their derivative metrics, relative permittivity, dissipation factor across varied temperatures and frequencies, and dielectric strength. These metrics are crucial for assessing the composite’s performance under various electrical and temperature stresses, essential for high-voltage applications. The outcome is a novel four-component material with enhanced dielectric properties compared to traditional composites. Polyamide nonwoven nanofabric significantly improved dielectric strength without compromising other dielectric parameters. On the other hand, polyamide film served as the carrier material that enhanced mechanical properties, which are discussed in a separate paper. This material could potentially replace conventional insulating materials in specific applications, thanks to its enhanced performance and reliability. A significant advantage of used resin is its VOC-free nature and low viscosity, which facilitate easy impregnation and effective dispersion of nanoparticles.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 IEEE International Conference on High Voltage Engineering and Applications (ICHVE)

ISBN

979-8-3503-7498-8

ISSN

2381-5043

e-ISSN

2474-3852

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Berlin, Germany

Datum konání akce

18. 8. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001332851100035