Mechanical and structural characterization of novel polyesterimide nanocomposites

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973916" target="_blank" >RIV/49777513:23220/24:43973916 - isvavai.cz</a>

Výsledek na webu

<a href="https://pubs.aip.org/aip/acp/article-abstract/3251/1/040008/3316937/Mechanical-and-structural-characterization-of" target="_blank" >https://pubs.aip.org/aip/acp/article-abstract/3251/1/040008/3316937/Mechanical-and-structural-characterization-of</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1063/5.0234045" target="_blank" >10.1063/5.0234045</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Mechanical and structural characterization of novel polyesterimide nanocomposites

Popis výsledku v původním jazyce

This study is part of a broad research to develop advanced composite material through the incorporation of nanofillers. Focusing in this article on dynamic mechanical and thermal properties, alongside charge density measurements. Evaluating a composite comprising of polyesterimide resin matrix filled with 1 wt.% silicon dioxide (SiO2) nanoparticles, supplemented with polyamide nonwoven nanofabric and polyamide film. Dynamic Mechanical Analysis (DMA) is employed to assess the viscoelastic behavior, stiffness, and damping properties of the composite under various mechanical stresses and temperatures. Simultaneous Thermal Analysis (STA) is conducted to evaluate the thermal stability and decomposition characteristics, which are essential for applications exposed to high temperatures. Charge density within the composite is measured using the Pulsed Electroacoustic (PEA) method, essential for analyzing the electrical charge distribution under electrical stress. Results indicate notable enhancements in mechanical damping and thermal stability. The use of an environmentally friendly, low-viscosity polyesterimide resin not only facilitates the manufacturing process but also improves the performance of the composite, positioning it as a viable alternative to traditional materials in demanding mechanical, thermal, and electrical applications. The synergistic effects of the nanoparticle and nanofabric reinforcement on the overall properties of the composite are highlighted, showcasing its potential for future use in high-performance engineering applications.

Název v anglickém jazyce

Mechanical and structural characterization of novel polyesterimide nanocomposites

Popis výsledku anglicky

This study is part of a broad research to develop advanced composite material through the incorporation of nanofillers. Focusing in this article on dynamic mechanical and thermal properties, alongside charge density measurements. Evaluating a composite comprising of polyesterimide resin matrix filled with 1 wt.% silicon dioxide (SiO2) nanoparticles, supplemented with polyamide nonwoven nanofabric and polyamide film. Dynamic Mechanical Analysis (DMA) is employed to assess the viscoelastic behavior, stiffness, and damping properties of the composite under various mechanical stresses and temperatures. Simultaneous Thermal Analysis (STA) is conducted to evaluate the thermal stability and decomposition characteristics, which are essential for applications exposed to high temperatures. Charge density within the composite is measured using the Pulsed Electroacoustic (PEA) method, essential for analyzing the electrical charge distribution under electrical stress. Results indicate notable enhancements in mechanical damping and thermal stability. The use of an environmentally friendly, low-viscosity polyesterimide resin not only facilitates the manufacturing process but also improves the performance of the composite, positioning it as a viable alternative to traditional materials in demanding mechanical, thermal, and electrical applications. The synergistic effects of the nanoparticle and nanofabric reinforcement on the overall properties of the composite are highlighted, showcasing its potential for future use in high-performance engineering applications.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

AIP Conference Proceedings: Applied Physics of Condensed Matter (APCOM 2024)

ISBN

978-0-7354-5060-8

ISSN

0094-243X

e-ISSN

1551-7616

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

AIP Publishing

Místo vydání

Slovensko

Místo konání akce

Štrbské Pleso, Slovensko

Datum konání akce

19. 6. 2024

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

—