Microfluidic device for AC electroosmotic fluid pumping

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Microfluidic device for AC electroosmotic fluid pumping

Popis výsledku v původním jazyce

We present the microfluidic device with an integrated AC electroosmotic micropump. These devices are able to manipulate small volumes of liquid samples and involve no moving parts. The local pumping system is driven by an AC signal with very low appliedvoltages. A technique for the fabrication of microfluidic device for electroosmotic fluid pumping is presented in this work. The micropump is realized by an array of microelectrodes coated along the microchannel. A fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is prepared by stamp and a mate with embedded gold electrodes made by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded together by UV/O3 activated thermal bonding

Název v anglickém jazyce

Microfluidic device for AC electroosmotic fluid pumping

Popis výsledku anglicky

We present the microfluidic device with an integrated AC electroosmotic micropump. These devices are able to manipulate small volumes of liquid samples and involve no moving parts. The local pumping system is driven by an AC signal with very low appliedvoltages. A technique for the fabrication of microfluidic device for electroosmotic fluid pumping is presented in this work. The micropump is realized by an array of microelectrodes coated along the microchannel. A fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is prepared by stamp and a mate with embedded gold electrodes made by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded together by UV/O3 activated thermal bonding

Druh

D - Stať ve sborníku

CEP obor

CI - Průmyslová chemie a chemické inženýrství

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 37th International Conference of Slovak Society of Chemical Engineering, 2010

ISBN

978-80-227-3290-1

ISSN

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e-ISSN

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Počet stran výsledku

8

Strana od-do

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Název nakladatele

Slovak Society of Chemical Engineering

Místo vydání

Bratislava

Místo konání akce

Tatranské Matliare, Slovakia

Datum konání akce

1. 1. 2010

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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