Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F10%3A00023212" target="_blank" >RIV/60461373:22340/10:00023212 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Popis výsledku v původním jazyce

A novel fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is made by micro-milling and a mate with embedded gold electrodesmade by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded togetherby thermally activated solvent bonding. Isopropyl alcohol (IPA) is used as a bonding agent. Using the IPA solvent brings several advantages compared to conventional thermal bonding: (i) decreasing the bonding temperature, (ii) higher bond strength. Decreasing the bonding temperature is crucial for the whole process, because of prevention of electrode cracking, microfluidic channel deformation and clogging. Higher bond strength prevents a liquid leakage and generally improves the microde

Název v anglickém jazyce

Fabrication of plastic microchips with gold microelectrodes using techniques of sacrificed substrate and thermally activated solvent bonding

Popis výsledku anglicky

A novel fabrication process of polymethyl methacrylate (PMMA) microfluidic chip with embedded gold microelectrodes has been developed. The PMMA chips consist of a microfluidic part, which is made by micro-milling and a mate with embedded gold electrodesmade by sacrificed substrate technique. The developed sacrificed substrate technique combines photolithography, gold electrodeposition and embedding of the gold structures into a UV curable resin. Both microfluidic and electrode parts are bonded togetherby thermally activated solvent bonding. Isopropyl alcohol (IPA) is used as a bonding agent. Using the IPA solvent brings several advantages compared to conventional thermal bonding: (i) decreasing the bonding temperature, (ii) higher bond strength. Decreasing the bonding temperature is crucial for the whole process, because of prevention of electrode cracking, microfluidic channel deformation and clogging. Higher bond strength prevents a liquid leakage and generally improves the microde

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

CI - Průmyslová chemie a chemické inženýrství

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronic Engineering

ISSN

0167-9317

e-ISSN

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Svazek periodika

87

Číslo periodika v rámci svazku

5-8

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

4

Strana od-do

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Kód UT WoS článku

000276300700232

EID výsledku v databázi Scopus

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