Fast and simple fabrication procedure of whole-glass microfluidic devices with metal electrodes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22340%2F13%3A43895674" target="_blank" >RIV/60461373:22340/13:43895674 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/49777513:23640/13:43919903

Výsledek na webu

<a href="http://dx.doi.org/10.1016/j.mee.2013.03.123" target="_blank" >http://dx.doi.org/10.1016/j.mee.2013.03.123</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.mee.2013.03.123" target="_blank" >10.1016/j.mee.2013.03.123</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Fast and simple fabrication procedure of whole-glass microfluidic devices with metal electrodes

Popis výsledku v původním jazyce

We developed a new process for the fabrication of whole-glass microfluidic chips with integrated metal electrode arrays. Our process is based on a novel technique allowing reliable bonding of two glass substrates, one with a microfluidic channel and thesecond one with an electrode array. The technique uses sodium silicate as an intermediate layer between the two glass substrates. The intermediate sodium silicate layer is shown to provide very tight bonding while preserving full functionality of the metal electrodes. The functionality of the electrode array was confirmed by impedance spectroscopy measurements with KCl solutions at different concentrations. To confirm the quality of the bonding, a solution of fluorescein was used as a fluorescent tracer. The results showed that there was no leakage out of the microfluidic channel and that the electrodes were free off sodium silicate where desired; hence the bonding is reliable and defect-free. This fabrication method can be satisfactori

Název v anglickém jazyce

Fast and simple fabrication procedure of whole-glass microfluidic devices with metal electrodes

Popis výsledku anglicky

We developed a new process for the fabrication of whole-glass microfluidic chips with integrated metal electrode arrays. Our process is based on a novel technique allowing reliable bonding of two glass substrates, one with a microfluidic channel and thesecond one with an electrode array. The technique uses sodium silicate as an intermediate layer between the two glass substrates. The intermediate sodium silicate layer is shown to provide very tight bonding while preserving full functionality of the metal electrodes. The functionality of the electrode array was confirmed by impedance spectroscopy measurements with KCl solutions at different concentrations. To confirm the quality of the bonding, a solution of fluorescein was used as a fluorescent tracer. The results showed that there was no leakage out of the microfluidic channel and that the electrodes were free off sodium silicate where desired; hence the bonding is reliable and defect-free. This fabrication method can be satisfactori

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

CI - Průmyslová chemie a chemické inženýrství

OECD FORD obor

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Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2013

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronic Engineering

ISSN

0167-9317

e-ISSN

—

Svazek periodika

110

Číslo periodika v rámci svazku

neuvedeno

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

5

Strana od-do

441-445

Kód UT WoS článku

000326003600089

EID výsledku v databázi Scopus

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