Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F12%3A86084322" target="_blank" >RIV/61989100:27360/12:86084322 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.322.41" target="_blank" >10.4028/www.scientific.net/DDF.322.41</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt

Popis výsledku v původním jazyce

Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phasedissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, Sn?Cu, Sn?Ag?Cu, Sn?Zn and Sn?In alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determinati

Název v anglickém jazyce

Reactive Diffusion at the Contact of a Solid Phase with the Solder Melt

Popis výsledku anglicky

Problems of reactive diffusion at the solid phase and melt contact are studied theoretically. The rate constant is a fundamental parameter characterizing the dissolving rate at a certain configuration of experiment. Relationships between the solid phasedissolving rate, i.e. the solid phase interface boundary movement in the melt, and rates of growth of intermetallic phases in the metal (Cu) are observed. This procedure enables the creation of surface and subsurface layers of regulated thickness in metallic materials by means of reactive diffusion. The main intention was an experimental study of copper dissolving in melts of various solder alloys and the related reactive diffusion. We used Sn, Sn?Cu, Sn?Ag?Cu, Sn?Zn and Sn?In alloys as a solder material. The problems that need to be solved preferentially are emphasized. It concerns especially the determination of the rate constant of dissolving and verifying whether the proposed model equations can be used for this constant determinati

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JG - Hutnictví, kovové materiály

OECD FORD obor

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Projekt

<a href="/cs/project/OC08032" target="_blank" >OC08032: Teoretické a experimentální studium fázových rovnováh materiálů pájek pro vysokoteplotní aplikace</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Defect and Diffusion Forum

ISSN

1012-0386

e-ISSN

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Svazek periodika

322

Číslo periodika v rámci svazku

Neuveden

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

32

Strana od-do

41-72

Kód UT WoS článku

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EID výsledku v databázi Scopus

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