Reactive diffusion upon planar dissolving of copper in solder melts

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F11%3A86081171" target="_blank" >RIV/61989100:27360/11:86081171 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >10.4028/www.scientific.net/DDF.309-310.127</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reactive diffusion upon planar dissolving of copper in solder melts

Popis výsledku v původním jazyce

Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu platedissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emph

Název v anglickém jazyce

Reactive diffusion upon planar dissolving of copper in solder melts

Popis výsledku anglicky

Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphase boundary movement depending on time and a time course of growth of the element A concentration in the melt B. The main intention was to study experimentally the copper dissolving in melts of various solder alloys and the related reactive diffusion. We used pure Sn and Sn-Cu, Sn-Ag-Cu, Sn-Sb, Sn-Zn alloys as solder materials. Experiments aimed at the study of a Cu platedissolving in the solder melt were carried out at various selected temperatures and times. The problems of reactive diffusion were studied both theoretically and experimentally and the problems that have to be solved preferably were emph

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JG - Hutnictví, kovové materiály

OECD FORD obor

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Projekt

<a href="/cs/project/OC08032" target="_blank" >OC08032: Teoretické a experimentální studium fázových rovnováh materiálů pájek pro vysokoteplotní aplikace</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Defect and Diffusion Forum

ISSN

1012-0386

e-ISSN

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Svazek periodika

309-310

Číslo periodika v rámci svazku

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Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

6

Strana od-do

127-134

Kód UT WoS článku

000291709300014

EID výsledku v databázi Scopus

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