Reactive Diffusion upon Planar Dissolving Copper in Solder Melts

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F11%3A10108528" target="_blank" >RIV/00216208:11320/11:10108528 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/DDF.309-310.127" target="_blank" >10.4028/www.scientific.net/DDF.309-310.127</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Reactive Diffusion upon Planar Dissolving Copper in Solder Melts

Popis výsledku v původním jazyce

Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. In our work we give heed especially to the dominating process, which is the solid metal A dissolving in solder melt B. During the dissolving, melt B saturates with metal A, and the process is influenced by convections which are characteristic for a given experimental configuration. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphasc boundary movement chi(t) depending on time and a time course of growth of the element Aconcentration in the melt B. There are difficulties in accurate determination of the interphase boundary movement after heating of specimens for certain time intervals. It should be performed experimentally, since intermetallic phases are

Název v anglickém jazyce

Reactive Diffusion upon Planar Dissolving Copper in Solder Melts

Popis výsledku anglicky

Problems of reactive diffusion at a solid phase - melt contact were studied theoretically. The main intention was to calculate the time course of the solid phase dissolving in the case of planar dissolving. In our work we give heed especially to the dominating process, which is the solid metal A dissolving in solder melt B. During the dissolving, melt B saturates with metal A, and the process is influenced by convections which are characteristic for a given experimental configuration. A theoretical description of the kinetics of solid phase dissolving in the melt will be presented for the case of planar dissolving. The aim is to derive a relation for the interphasc boundary movement chi(t) depending on time and a time course of growth of the element Aconcentration in the melt B. There are difficulties in accurate determination of the interphase boundary movement after heating of specimens for certain time intervals. It should be performed experimentally, since intermetallic phases are

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BM - Fyzika pevných látek a magnetismus

OECD FORD obor

—

Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Diffusion and Defect Data. Pt A Defect and Diffusion Forum

ISSN

1012-0386

e-ISSN

—

Svazek periodika

309-310

Číslo periodika v rámci svazku

—

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

8

Strana od-do

127-134

Kód UT WoS článku

000291709300014

EID výsledku v databázi Scopus

—