Research of the new soldering alloys based on Sn-Sr and Sn-Ag-Sr
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F21%3A10248642" target="_blank" >RIV/61989100:27360/21:10248642 - isvavai.cz</a>
Výsledek na webu
<a href="https://ijettjournal.org/Volume-69/Issue-10/IJETT-V69I10P207.pdf" target="_blank" >https://ijettjournal.org/Volume-69/Issue-10/IJETT-V69I10P207.pdf</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.14445/22315381/IJETT-V69I10P207" target="_blank" >10.14445/22315381/IJETT-V69I10P207</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Research of the new soldering alloys based on Sn-Sr and Sn-Ag-Sr
Popis výsledku v původním jazyce
The aim of the research was to characterize the soldering alloys type Sn1Sr and Sn3.5Ag1Sr. The DTA analysis of Sn1Sr solder has identified the eutectic reaction at the temperature of 232 oC. In the case of Sn3.5Ag1Sr solder, the eutectic reaction takes place at the temperature of 222 oC, which corresponds to the thermodynamic data for the given alloy type Sn-Ag-Sr. The microstructural SEM analysis has identified in soldering alloy type Sn1Sr the needles of primary precipitated intermetallic phase in the matrix formed of peritectic together with Sn, having majority proportion in the matrix. In the Sn1Sr solder, there was additionally observed the (Sn) + SrSn4 eutectics with a high tin content. When analyzing the microstructure of Sn3.5Ag1Sr solder, the acicular constituents formed of εAg3Sn and Sr-Ag-Sn phases were observed. Also, the (Sn) + ε-Ag3Sn eutectics was identified in solder volume. The solder matrix is formed of pure tin. (C) 2021 Seventh Sense Research Group(R).
Název v anglickém jazyce
Research of the new soldering alloys based on Sn-Sr and Sn-Ag-Sr
Popis výsledku anglicky
The aim of the research was to characterize the soldering alloys type Sn1Sr and Sn3.5Ag1Sr. The DTA analysis of Sn1Sr solder has identified the eutectic reaction at the temperature of 232 oC. In the case of Sn3.5Ag1Sr solder, the eutectic reaction takes place at the temperature of 222 oC, which corresponds to the thermodynamic data for the given alloy type Sn-Ag-Sr. The microstructural SEM analysis has identified in soldering alloy type Sn1Sr the needles of primary precipitated intermetallic phase in the matrix formed of peritectic together with Sn, having majority proportion in the matrix. In the Sn1Sr solder, there was additionally observed the (Sn) + SrSn4 eutectics with a high tin content. When analyzing the microstructure of Sn3.5Ag1Sr solder, the acicular constituents formed of εAg3Sn and Sr-Ag-Sn phases were observed. Also, the (Sn) + ε-Ag3Sn eutectics was identified in solder volume. The solder matrix is formed of pure tin. (C) 2021 Seventh Sense Research Group(R).
Klasifikace
Druh
J<sub>SC</sub> - Článek v periodiku v databázi SCOPUS
CEP obor
—
OECD FORD obor
20500 - Materials engineering
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2021
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
SSRG International Journal of Engineering Trends and Technology
ISSN
2349-0918
e-ISSN
—
Svazek periodika
69
Číslo periodika v rámci svazku
10
Stát vydavatele periodika
IN - Indická republika
Počet stran výsledku
6
Strana od-do
46-51
Kód UT WoS článku
—
EID výsledku v databázi Scopus
2-s2.0-85117234748