Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress.

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F02%3A07023100" target="_blank" >RIV/68081723:_____/02:07023100 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress.

Popis výsledku v původním jazyce

The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these twotemperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold s

Název v anglickém jazyce

Creep of ODS Copper in Two Distinctly Different Temperature Intervals as Interpreted in Terms of the True Threshold Stress.

Popis výsledku anglicky

The creep data for copper strengthened with fine alumina particles - a commercial GlidCop Al-15 alloy, presented by Broyles et al. - are interpreted in terms of the true threshold stress. It is shown that at high testing temperatures 973 and 998 K the minimum creep strain rate is apparently controlled by lattice self-diffusion in the alloy matrix - copper - and that the true stress exponent of minimum creep strain rate is very close to that reported for copper, i.e. close to 5. At much lower testing temperatures of 748 and 773 K, the minimum creep strain rate is found to be controlled by the dislocation core diffusion in copper, and, accordingly, the true stress exponent of minimum creep strain rate is close to 7. The creep data available for these twotemperatures made it possible to prove that the apparent activation energy of creep is much higher than the activation enthalpy of dislocation core diffusion, which is essentially due to the temperature dependence of the true threshold s

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JG - Hutnictví, kovové materiály

OECD FORD obor

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Projekt

<a href="/cs/project/IBS2041001" target="_blank" >IBS2041001: Degradace vlastností a životnost inženýrských materiálů při jejich mechanickém namáhání</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2002

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

KOVOVÉ MATERIÁLY

ISSN

0023-432X

e-ISSN

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Svazek periodika

40

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

SK - Slovenská republika

Počet stran výsledku

11

Strana od-do

231-241

Kód UT WoS článku

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EID výsledku v databázi Scopus

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