Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00386294" target="_blank" >RIV/68081723:_____/12:00386294 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

Popis výsledku v původním jazyce

Experiments were conducted to determine an effect of ECAP pressing on the creep behavior of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373, 473 and 573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. The results demonstrate that the n of coarse-grained material increases from the value n 6 measured at 573K to the value of n 14 determined at 373 K. However, the values of stress exponent n of UFG material were about 6 at 373, 473 and 573 K over relatively wide range of strain rates. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). It was found that the change of grain size and number of high-angle grain boundaries in the microstructure influence the transition fro

Název v anglickém jazyce

Influence of Grain Size on Creep Behavior of Copper Processed by ECAP

Popis výsledku anglicky

Experiments were conducted to determine an effect of ECAP pressing on the creep behavior of pure Cu. The ECAP pressing was performed at room temperature by route Bc. Constant load creep tests in tension were conducted at 373, 473 and 573 K under different stresses. The values of the stress exponent n of the minimum creep rate for ultrafine-grained (UFG) and coarse-grained material were determined. The results demonstrate that the n of coarse-grained material increases from the value n 6 measured at 573K to the value of n 14 determined at 373 K. However, the values of stress exponent n of UFG material were about 6 at 373, 473 and 573 K over relatively wide range of strain rates. Microstructure of samples was characterized by transmission electron microscope (TEM) and scanning electron microscope (SEM) equipped with the electron backscatter unit (EBSD). It was found that the change of grain size and number of high-angle grain boundaries in the microstructure influence the transition fro

Druh

D - Stať ve sborníku

CEP obor

JJ - Ostatní materiály

OECD FORD obor

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Projekt

<a href="/cs/project/GPP108%2F10%2FP469" target="_blank" >GPP108/10/P469: Vliv výchozí krystalografické orientace na creepové chování SPD materiálů</a><br>

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Creep and Fracture of Engineering Materials and Structure

ISBN

978-4-88903-407-3

ISSN

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e-ISSN

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Počet stran výsledku

4

Strana od-do

460-464

Název nakladatele

The Japan Institute of Metals

Místo vydání

Sendai

Místo konání akce

Kyoto

Datum konání akce

27. 5. 2012

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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