Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F23%3A00577521" target="_blank" >RIV/68081723:_____/23:00577521 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/61989100:27360/23:10253174

Výsledek na webu

<a href="https://www.mdpi.com/1996-1944/16/19/6555" target="_blank" >https://www.mdpi.com/1996-1944/16/19/6555</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma16196555" target="_blank" >10.3390/ma16196555</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Popis výsledku v původním jazyce

The study presents a method to prepare Al/Cu laminated conductors featuring two different stacking sequences using rotary swaging, a method of intensive plastic deformation. The primary focus of the work was to perform detailed characterization of the effects of room temperature swaging on the development of microstructures, including the Al/Cu interfaces, and internal misorientations pointed to the presence of residual stress within the laminates. The results revealed that both the Al and Cu components of the final laminates with 5 mm in diameter featured fine, more or less equiaxed, grains with no dominating preferential texture orientations (the maximum observed texture intensity was 2.3 x random for the Cu components of both the laminates). This fact points to the development of dynamic restoration processes during swaging. The analyses of misorientations within the grains showed that residual stress was locally present primarily in the Cu components. The Al components did not feature a substantial presence of misorientations, which confirms the dynamic recrystallization. Tensile testing revealed that the laminates with both the designed stacking sequences exhibited comparable UTS (ultimate tensile strength) of almost 280 MPa. However, notable differences were observed with regard to the plasticity (similar to 3.5% compared to less than 1%). The laminate consisting of Al sheath and Cu wires exhibited very low plasticity as a result of significant work hardening of Al, this hypothesis was also confirmed with microhardness measurements. Observations of the interfaces confirmed satisfactory bonding of both the metallic components.

Název v anglickém jazyce

Effect of Stacking Sequence on Mechanical Properties and Microstructural Features within Al/Cu Laminates

Popis výsledku anglicky

The study presents a method to prepare Al/Cu laminated conductors featuring two different stacking sequences using rotary swaging, a method of intensive plastic deformation. The primary focus of the work was to perform detailed characterization of the effects of room temperature swaging on the development of microstructures, including the Al/Cu interfaces, and internal misorientations pointed to the presence of residual stress within the laminates. The results revealed that both the Al and Cu components of the final laminates with 5 mm in diameter featured fine, more or less equiaxed, grains with no dominating preferential texture orientations (the maximum observed texture intensity was 2.3 x random for the Cu components of both the laminates). This fact points to the development of dynamic restoration processes during swaging. The analyses of misorientations within the grains showed that residual stress was locally present primarily in the Cu components. The Al components did not feature a substantial presence of misorientations, which confirms the dynamic recrystallization. Tensile testing revealed that the laminates with both the designed stacking sequences exhibited comparable UTS (ultimate tensile strength) of almost 280 MPa. However, notable differences were observed with regard to the plasticity (similar to 3.5% compared to less than 1%). The laminate consisting of Al sheath and Cu wires exhibited very low plasticity as a result of significant work hardening of Al, this hypothesis was also confirmed with microhardness measurements. Observations of the interfaces confirmed satisfactory bonding of both the metallic components.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20505 - Composites (including laminates, reinforced plastics, cermets, combined natural and synthetic fibre fabrics; filled composites)

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Svazek periodika

16

Číslo periodika v rámci svazku

19

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

14

Strana od-do

6555

Kód UT WoS článku

001081205800001

EID výsledku v databázi Scopus

2-s2.0-85174073239