Lift-off technology for thick metallic microstructures

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Lift-off technology for thick metallic microstructures

Popis výsledku v původním jazyce

This paper deals with a method enabling the preparation of thick metallic microstructures on metal substrates. Such metallic microstructures can be used as a resolution samples to characterize various microanalysis techniques, such as X-ray fluorescence (XRF) or X-ray photoelectron spectroscopy (XPS). Moreover, thenpatterned samples could be used as anodes to characterize focusing properties of X-ray tubes for micro CT systems. Considering that the standard lift-off technique is designated for structures with the thickness of several hundred nanometers at most, we had to modify lift-off technique to be possible to use it for preparation of very thick metal layers (several microns) with spatial resolution of a few microns. The mask with the desired pattern for UV exposure was prepared by e-beam lithography. SU-8 photoresist was used for a lift-off because of its aspect ratio ability, process purity and high resistance to heating. We used a thin layer of PMMA under the SU-8 masking layer to guarantee the photoresist would lift-off correctly. Thick aluminum layer was deposited by thermal evaporation. The dependence of metal layer thickness as a function of required exposednline width was determined. The final lift-off process was carried out in acetone ultrasonic bath. Generally, this technology can be used for the evaporate deposition of various materials with several microns thick layer innmicron resolution.

Název v anglickém jazyce

Lift-off technology for thick metallic microstructures

Popis výsledku anglicky

This paper deals with a method enabling the preparation of thick metallic microstructures on metal substrates. Such metallic microstructures can be used as a resolution samples to characterize various microanalysis techniques, such as X-ray fluorescence (XRF) or X-ray photoelectron spectroscopy (XPS). Moreover, thenpatterned samples could be used as anodes to characterize focusing properties of X-ray tubes for micro CT systems. Considering that the standard lift-off technique is designated for structures with the thickness of several hundred nanometers at most, we had to modify lift-off technique to be possible to use it for preparation of very thick metal layers (several microns) with spatial resolution of a few microns. The mask with the desired pattern for UV exposure was prepared by e-beam lithography. SU-8 photoresist was used for a lift-off because of its aspect ratio ability, process purity and high resistance to heating. We used a thin layer of PMMA under the SU-8 masking layer to guarantee the photoresist would lift-off correctly. Thick aluminum layer was deposited by thermal evaporation. The dependence of metal layer thickness as a function of required exposednline width was determined. The final lift-off process was carried out in acetone ultrasonic bath. Generally, this technology can be used for the evaporate deposition of various materials with several microns thick layer innmicron resolution.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20506 - Coating and films

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

METAL 2017. 26th International Conference on Metallurgy and Materials. Conference Proceedings

ISBN

978-80-87294-79-6

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

1298-1302

Název nakladatele

TANGER

Místo vydání

Ostrava

Místo konání akce

Brno

Datum konání akce

24. 5. 2017

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000434346900208