Low-temperature emissivity of thin Al2O3 layers deposited on copper substrate

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081731%3A_____%2F21%3A00552663" target="_blank" >RIV/68081731:_____/21:00552663 - isvavai.cz</a>

Výsledek na webu

<a href="https://iifiir.org/fr/fridoc/emissivite-a-basse-temperature-de-couches-minces-144402" target="_blank" >https://iifiir.org/fr/fridoc/emissivite-a-basse-temperature-de-couches-minces-144402</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.18462/iir.cryo.2021.0042" target="_blank" >10.18462/iir.cryo.2021.0042</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Low-temperature emissivity of thin Al2O3 layers deposited on copper substrate

Popis výsledku v původním jazyce

Copper is commonly used in cryogenic systems due to its high thermal and electrical conductivity along with excellent solderability. Very low emissivity values of copper surface also reduce in cryogenic systems heat load transferred by thermal radiation. These values may be, however, enhanced by a prospective coating, deposited usually in order to prevent chemical changes on highly reactive copper surface. This paper focuses on protective layers of Al2O3 with thicknesses up to 28 nm, deposited on polished copper. We measured total hemispherical emissivity at cryogenic temperatures before and after the coating process. Contribution of Al2O3 layer to original copper emissivity increased with rising temperature of the layer and with the layer thickness. However, emissivity of the coated copper stayed below 2%, allowing usage of the coated copper in systems where low heat load by thermal radiation is needed. Preliminary tests with oxygen plasma shows that deposited layers can effectively protect the copper surface against oxidation and maintain the original thermal-radiative properties.

Název v anglickém jazyce

Low-temperature emissivity of thin Al2O3 layers deposited on copper substrate

Popis výsledku anglicky

Copper is commonly used in cryogenic systems due to its high thermal and electrical conductivity along with excellent solderability. Very low emissivity values of copper surface also reduce in cryogenic systems heat load transferred by thermal radiation. These values may be, however, enhanced by a prospective coating, deposited usually in order to prevent chemical changes on highly reactive copper surface. This paper focuses on protective layers of Al2O3 with thicknesses up to 28 nm, deposited on polished copper. We measured total hemispherical emissivity at cryogenic temperatures before and after the coating process. Contribution of Al2O3 layer to original copper emissivity increased with rising temperature of the layer and with the layer thickness. However, emissivity of the coated copper stayed below 2%, allowing usage of the coated copper in systems where low heat load by thermal radiation is needed. Preliminary tests with oxygen plasma shows that deposited layers can effectively protect the copper surface against oxidation and maintain the original thermal-radiative properties.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20303 - Thermodynamics

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Cryogenics 2021 online. The 16th Cryogenics 2021 IIR International Conference, October 5-7, 2021. Proceedings

ISBN

978-2-36215-047-0

ISSN

0151-1637

e-ISSN

—

Počet stran výsledku

6

Strana od-do

113-118

Název nakladatele

ICCEX

Místo vydání

Praha

Místo konání akce

online

Datum konání akce

5. 10. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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