Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F23%3A00572409" target="_blank" >RIV/68378271:_____/23:00572409 - isvavai.cz</a>
Nalezeny alternativní kódy
RIV/68407700:21220/23:00366029 RIV/00216208:11320/23:10467293
Výsledek na webu
<a href="https://doi.org/10.1016/j.apsusc.2023.157276" target="_blank" >https://doi.org/10.1016/j.apsusc.2023.157276</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.apsusc.2023.157276" target="_blank" >10.1016/j.apsusc.2023.157276</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films
Popis výsledku v původním jazyce
We report a simple and efficient two-step experimental procedure of glass metallization using laser microstructuring at ambient conditions. An adhesive pattern was created on the glass substrate using a laser, which imposes mechanical interlocking. An adhesive Cu layer was deposited on the glass substrate by magnetron sputtering and then electroplated with a functional Cu layer. Due to the unique surface structure created on the glass using laser, we achieved a thick layer of Cu metal film with high adhesion strength, well-defined grains and grain boundaries, and low surface roughness. The total thickness of the grown film was 11.4 µm, with an average surface roughness of 1.2 µm. The magnetron-sputtered coating did not show delamination from the glass substrate at a critical load of 60 N. The proposed method of glass metallization will lead to the realization of glass-based circuit materials that can be used in high-frequency electronic devices. Also, this procedure will be an alternative to chemical-based copper plating, which involves multiple processing steps and high-cost chemicals.
Název v anglickém jazyce
Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films
Popis výsledku anglicky
We report a simple and efficient two-step experimental procedure of glass metallization using laser microstructuring at ambient conditions. An adhesive pattern was created on the glass substrate using a laser, which imposes mechanical interlocking. An adhesive Cu layer was deposited on the glass substrate by magnetron sputtering and then electroplated with a functional Cu layer. Due to the unique surface structure created on the glass using laser, we achieved a thick layer of Cu metal film with high adhesion strength, well-defined grains and grain boundaries, and low surface roughness. The total thickness of the grown film was 11.4 µm, with an average surface roughness of 1.2 µm. The magnetron-sputtered coating did not show delamination from the glass substrate at a critical load of 60 N. The proposed method of glass metallization will lead to the realization of glass-based circuit materials that can be used in high-frequency electronic devices. Also, this procedure will be an alternative to chemical-based copper plating, which involves multiple processing steps and high-cost chemicals.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
10306 - Optics (including laser optics and quantum optics)
Návaznosti výsledku
Projekt
<a href="/cs/project/EF15_006%2F0000674" target="_blank" >EF15_006/0000674: HiLASE Centre of Excellence</a><br>
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2023
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Applied Surface Science
ISSN
0169-4332
e-ISSN
1873-5584
Svazek periodika
627
Číslo periodika v rámci svazku
Aug.
Stát vydavatele periodika
NL - Nizozemsko
Počet stran výsledku
7
Strana od-do
157276
Kód UT WoS článku
000988755400001
EID výsledku v databázi Scopus
2-s2.0-85153573521